Texas Instruments Inc (TXN)

[Eric]

UMTS Chipsets: TI (PR)

TI claims:

* More than 50 percent share of the 3G semiconductor marketplace with both its market-leading 3G modems and OMAP processors.

* TI´s 3G technology is currently used in over 45 different handset models shipping worldwide today from six of the top seven 3G manufacturers.

* TI's OMAP processors have been selected by 3G handset manufacturers to power NTT DoCoMo's new 3G FOMA 901i and 700i series.

TI´s has a joint agreement with NTT DoCoMo to develop a cost-competitive, multi-mode UMTS (WCDMA/GSM/GPRS/EDGE) chipset to serve the worldwide 3G handset marketplace.

* TI, collaborating with NTT DoCoMo, will provide an integrated UMTS digital baseband and applications processor based on TI´s OMAP 2 architecture and NTT DoCoMo´s WCDMA technology for NTT DoCoMo handsets and other 3G handsets worldwide.

* TI´s new family of OMAP-Vox wireless solutions, combine mobile phone modems and multimedia applications processing in a single product with extensive software reuse from one generation of phones to the next. This reduces development time and allows manufacturers to quickly bring a variety of handsets to market to meet the high-volume needs of the 2.5G marketplace today, with a quick migration to 3G.

>> TI Wireless Executive Details Company's Success and Commitment in Driving 3G to The Masses

Powering Over 45 Mobile Phones in 3G Marketplace Today, TI 3G Technology Included in All New Models of NTT DoCoMo's FOMA(R) 901i and 700i Series of 3G Mobile Phones

Ti Press Release
Tokyo
March 29, 2005

http://tinyurl.com/3rmmd

Underscoring a commitment to foster the widespread adoption of 3G, Gilles Delfassy, Texas Instruments Incorporated (TI) (NYSE: TXN) senior vice president and general manager of its Wireless Terminals Business Unit, detailed in a Tokyo press conference today how TI's 3G technology is being widely adopted worldwide.

"With more than 50 percent share of the 3G semiconductor marketplace with both its market-leading 3G modems and OMAP processors, TI´s 3G technology is currently used in over 45 different handset models shipping worldwide today from six of the top seven 3G manufacturers," Delfassy said.

Further, Delfassy announced that TI's OMAP processors have been selected by 3G handset manufacturers to power NTT DoCoMo's new 3G FOMA 901i and 700i series for the most advanced multimedia performance and power efficiency requirements. "The rapid acceleration of 3G is due largely to early adoption by the technology savvy Japanese market. Clearly Japan continues to lead the world in 3G innovation, and TI is proud to be a part of this growth."

TI's OMAP family of applications processors have been used by 3G handsets manufacturers for three consecutive years for NTT DoCoMo's FOMA 3G series of mobile phones, which now service more than 10 million subscribers in the rapidly growing Japanese 3G market, as well as powering NTT DoCoMo's new 3G FOMA 901i and 700i series.

Delfassy added, "We are pleased to continue our long-standing, collaborative relationship with 3G handset manufacturers to deliver the ultimate 3G mobile phones to Japanese consumers, while driving widespread adoption of 3G beyond Japan."

Delfassy also referred to TI´s joint agreement with NTT DoCoMo to develop a cost-competitive, multi-mode UMTS (WCDMA/GSM/GPRS/EDGE) chipset to serve the worldwide 3G handset marketplace. "Both companies aim to foster the earliest possible widespread use of 3G handsets by creating winning solutions for the 3G marketplace," Delfassy remarked. "TI, collaborating with NTT DoCoMo, will provide an integrated UMTS digital baseband and applications processor based on TI´s OMAP 2 architecture and NTT DoCoMo´s WCDMA technology for NTT DoCoMo handsets and other 3G handsets worldwide."

TI continues to take a comprehensive approach to the complex and wide-ranging technology requirements of 3G technology to bring 3G to the masses, building on its 15 years of experience in the wireless industry and leadership in GSM/GPRS. Delfassy cited TI´s new family of OMAP-Vox wireless solutions, which combines mobile phone modems and multimedia applications processing in a single product with extensive software reuse from one generation of phones to the next. This reduces development time and allows manufacturers to quickly bring a variety of handsets to market to meet the high-volume needs of the 2.5G marketplace today, with a quick migration to 3G.

Delfassy noted that several other recent TI innovations, including those based on the company´s innovative DRP technology, will support the wireless industry´s growth and global penetration. Specifically, he highlighted TI´s single-chip solution for mobile phones that will accelerate wireless penetration by enabling low-cost mobile phones in emerging, high-growth areas such as China, India and Latin America. He also mentioned TI´s single-chip solution for live digital broadcast TV on mobile phones, which will support open, non-proprietary standards such as the Japanese specification, Integrated Services Digital Broadcasting-Terrestrial (ISDB-T), and Digital Video Broadcasting-Handheld (DVB-H) in Europe and the U.S. Also, the company´s OMAP 2 processors will enable mobile phones with multi-megapixel cameras, digital video recorders, 3D multiplayer gaming, CD-quality audio, and more.

"TI's objective is to help operators and manufacturers put real power into the hands of their customers - billions of customers worldwide," Delfassy said. "By continuing to work closely with our customers and mobile operators, we are confident that we have the right pieces in place today that will promote wireless growth and choice in the marketplace." <<

- Eric -