Liquidmetal Technologies Inc (LQMT)

[joshuaeyu]

This post beings up thermal grease (diamond gel). It just reminds me now why NVidia is customer of Eontec.

AR world has brought new live to both NVidia and AMD.

Quietly Apple has also created its own "half register" GPU core for power (thermal) efficiency and perhaps avoid Samsung flame-gate.

With Tim Cook pushing for AR hence full control of the portable game platform, Apple has a chance to monopolize the market with in house proprietary hardware technology.

With Moore's Law winding down, and AR world just started, there will be serious technological mismatch.

CIP patent BMG use case as PCB substrate to allow direct "die bonding". Initially I thought it will be great marriage to analog world (for transparency) to misc wireless receivers to cover power charging, NFC, next gen Bluetooth, just to name a few. Now I realize CPU can also obtain great "thermal relief" with direct bonding to that very same BMG substrate. Look for future phone to feel mighty toasty.

With chip "die" bonding grid in nano size, it requires material (BMG) that can meet that ultra precision of 40 nm.

"Corning glass + Stainless Steel" will not fulfill the above requirements in the long run.