Liquidmetal Technologies Inc (LQMT)

[joshuaeyu]

Apple latest patent using BMG as PCB (printed circuit board) substrate

It will allow super small electronic (such as silicon die) to be interconnected.

While Moore's Law has affected our lives so much for the past 50 years, silicon interconnect has been constrained by its carrying agent (such as chip packaging and PCB)

BMG has the characteristics of precision down to 0.5 mil (one thousand of an inch). It is Apple's vision that someday all their silicon die will be bonded together via the BMG substrate. This has a 10x advantage on miniturization It also can provide 10x resolution increase for touch sensor for Apple next generation 3D multi touch.