RTEC conference call. Mention of Apple and Qualcomm
"Patrick Ho - Stifel, Nicolaus & Company, Inc.
Great. In terms of the litho applications that you’re starting to see gain adoption in the market place. From a broader market perspective and not maybe Rudolph specifically how fast do you see the industry adopting some of these “new applications” that will drive the JetStep solution versus traditional 1x steppers?
Paul McLaughlin - Chairman and CEO
That’s a very good question. Never fast enough, Patrick, but I’ll be honest with you, I think we’re seeing it -- I think you’re going to see a lot of action in the copper pillar area. The copper pillar bumps that were 20 microns apart from each other a quarter or two ago just aren’t cutting at it the leading edge. So you’d be coming down below 10 microns going to 5 microns, and of course would love to see the market driven by the two big guys. The two big guys being Qualcomm and Apple going down to 2 micron lines and spaces, that’s a wonderful driver for Rudolph. Is it real soon? Well we think they’re dabbling in it right now. So, I think it may be sooner than later. But the big volume is a couple of years away for that kind of thing I would think, maybe a year away."
1/2 cent Vancouver penny mooching pirates!
