Intel Corp (INTC)

[jfine]

Chipworks has begun to analyze the A8 processor

UPDATE – we’ve added above the die photograph showing the top metal layer.

The die size is 8.5 mm x 10.5 mm = 89.25 mm2, as stated by Apple. Indications are that it is fabbed by TSMC, but we don’t have enough images yet to be 100% sure. The first cross section of the structure shows that there are ten metals in the stack (see the third thumbnail image above).

We can tell you that the contacted gate pitch is ~90 nm, which agrees with our report on the Qualcomm MDM9235, also fabbed by TSMC in their 20 nm process. (Contacted gate pitch is a measure of the process node in which a device is manufactured, and is quoted in most technical papers when a company announces a new process.)

After seeing more die markings, we should add that the P0XY “part number” referred to above appears to be a lot code, since the equivalent markings on other dies are very different; so only a coincidental row of digits, not an unfortunate device designation. More to come on the A8 next week!

http://www.chipworks.com/en/technical-competitive-analysis/resources/blog/inside-the-iphone-6-and-iphone-6-plus/