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ASML Confirms EUV Tool at IBM Reached 637 Wafers per 24 Hours

8:42 AM ET 7/30/14 | Dow Jones
By Ben Zwirs

AMSTERDAM--Dutch semiconductor equipment maker ASML Holding NV (ASML) confirmed reports that one of its extreme ultraviolet, or EUV, lithography machines reached a throughput of 637 wafers per day, ahead of the target of 500 wafers it gave in its second quarter earnings report.

"Our engineers were present at the IBM site," when the machine processed 637 wafers in 24 hours, Niclas Mika, a spokesman for ASML said Wednesday. He declined to comment if other customers were also able to reach similar performance with ASML's EUV system.

In its second quarter earnings report two weeks ago ASML said it was on track to reach the targeted 500 wafers per day around the end of the year. By 2016 the company aims to process 1,500 wafers per day.

EUV is the next generation of lithography systems needed for the continuation of Moore's Law, which says the amount of transistors that could be fitted on a chip of a given size at an acceptable cost doubles every two years.

At this moment, ASML is up over +15 percent for the day.