First lets see what the company does SEQUANS COMMUNICATIONS
is a world-leading 4G chipmaker, supplying LTE and WiMAX chips to wireless equipment and device manufacturers worldwide. Founded in 2003 to address the WiMAX opportunity where it is now a global leader, Sequans expanded in 2009 to address the LTE market. Sequans' chips are inside the world's leading WiMAX networks and will soon be inside LTE networks. Sequans is based in Paris, with additional offices throughout the world, including USA, United Kingdom, Israel, Hong Kong, China, Singapore, and Taiwan
Now lets meet the people in charge http://www.sequans.com/company/executive-team/
SQNS has some very nice customers in the business http://www.sequans.com/ecosystem/customers/
Here are some articles that mention SQNS http://pulse.alacra.com/analyst-comments/Sequans_Communications_SA-C4447761 http://techaxcess.com/2011/03/ http://econferencingnews.com/lte-technology-collaboration-targets-td-lte-operator-trials/635010/ http://wirelessfederation.com/news/company/sequans-communications/
POWERED BY SEQUANS http://www.sequans.com/ecosystem/powered-by-sequans/
Here are some nice interviews with Sequans. http://www.youtube.com/watch?v=YKWqXQKHN4o http://www.youtube.com/watch?v=7v3I5e99g_Q http://www.youtube.com/watch?v=giZ6amnCT1s http://www.youtube.com/watch?v=gEaYRCyBeRs http://www.youtube.com/watch?v=CvdqluzUD_k
HERE ARE SOME NICE NEWS HIGHLIGHTS!!!
PARIS, France - April 28, 2011 - Sequans Communications S.A. (NYSE: SQNS), a 4G chipmaker, supplying LTE and WiMAX chips to original equipment manufacturers worldwide, today announced its financial results for the first quarter ended March 31, 2011.
First Quarter 2011 Highlights:
All figures are unaudited and reported in U.S. dollars in accordance with International Financial Reporting Standards, or IFRS, as issued by the International Accounting Standards Board. Condensed and consolidated financial tables are provided at the end of this release.
Revenue: Revenue of $25.4 million increased 11% compared to the fourth quarter of 2010 and 149% compared to the first quarter of 2010.
Operating income (loss): Operating income of $2.3 million increased 302% compared to the fourth quarter of 2010, and represented 8.9% of revenue, compared to an operating loss of $2.2 million in the first quarter of 2010.
Net profit (loss): Net profit was $1.9 million, or $0.07 per diluted share/ADS, compared to a net loss of $2.8 million, or $(0.10) per diluted share/ADS in the fourth quarter of 2010 and a net loss of $1.4 million, or $(0.06) per diluted share/ADS in the first quarter of 2010.
| || || || || || |
In millions of $US except percentages, shares and per share amounts
| || || || ||Key Metrics |
| || || || ||Q1 2011 || || || ||%* || || || ||Q4 2010 || || || ||%* || || || ||Q1 2010 || || || ||%* |
| || || || || || || || || || || || || || || || || || || || || || || || || || |
|Revenue || || || || ||$25.4 || || || || || || || ||$22.9 || || || || || || || ||$10.2 || || || || |
|Gross profit || || || || ||13.0 || || || ||51.2% || || || ||11.5 || || || ||50.4% || || || ||6.0 || || || ||58.7% |
|Operating income (loss) || || || || ||2.3 || || || ||8.9% || || || ||0.6 || || || ||2.5% || || || ||(2.2) || || || ||(21.5%) |
|Net profit (loss) || || || || ||1.9 || || || ||7.5% || || || ||(2.8) || || || ||(12.1%) || || || ||(1.4) || || || ||(13.3%) |
|Diluted EPS/ADS || || || || ||$0.07 || || || || || || || ||$(0.10) || || || || || || || ||$(0.06) || || || || |
|Number of diluted shares/ADS || || || || ||29,164,738 || || || || || || || ||26,721,605 || || || || || || || ||23,696,452 || || || || |
|Cash flow from (used in) operations || || || || ||0.3 || || || || || || || ||7.9 || || || || || || || ||(1.7) || || || || |
| || || || || || || || || || || || || || || || || || || || || || || || || || |
|Additional information: || || || || || || || || || || || || || || || || || || || || || || || || || |
|Stock-based compensation included in operating result || || || || ||0.5 || || || || || || || ||0.3 || || || || || || || ||0.3 || || || || |
|Non-IFRS diluted EPS (excludes stock-based compensation) || || || || ||$0.08 || || || || || || || ||$(0.09) || || || || || || || ||$(0.05) || || || || |
| || || || || || || || || || || || || || || || || || || || || || || || || || |
* Percentage of revenue
| || || || || || || || || || || || || || || || || || || || || || || || || || |
"Our first quarter results reflect continued strong demand for 4G devices to support bandwidth-intensive mobile data applications," said Georges Karam, Sequans CEO. "In particular, we are benefitting from our position as the 4G chip supplier to HTC's EVO 4G and EVO Shift smartphones. Our growth is also being fueled by our customers serving emerging markets with devices that enable basic broadband connectivity to the home or enterprise. We are pursuing additional design wins that would further diversify our customer base, and we are involved in LTE trials in key markets such as China and India. Meanwhile, we are able to generate substantial operating leverage by carefully managing the growth in operating expenses and capitalizing on our depth of experience in 4G by shifting resources as the technologies evolve."
Newly NYSE-listed, 4G chipmaker progresses
PARIS, France - May 19, 2011 - 4G chipmaker Sequans Communications S.A. (NYSE: SQNS) today announced that it has shipped its ten millionth 4G chip. The announcement was made by Sequans' CEO, Georges Karam after the Opening BellSM ceremony at NYSE Euronext Paris where Mr. Karam and his senior executives and founders were on hand to celebrate the company's recent IPO and listing on the New York Stock Exchange. Sequans began in 2003 as a WiMAX chipmaker and in 2009 established its LTE program. Today, Sequans' chips are inside leading 4G devices, such as the HTC EVO 4G smartphone launched by Sprint in USA and the HTC EVO WiMAX smartphone launched by KDDI in Japan.
"It is very gratifying to announce this milestone achievement at the same time we are celebrating our IPO," said Georges Karam, Sequans CEO. "Our shipments have increased steadily as 4G networks have proliferated around the world. In the last two years, our rate of units shipped has increased from around one million per year in 2009, to one million per quarter on average in 2010, to approaching one million per month today.
"When we founded Sequans, it was our dream that one day Sequans would be powering 4G devices all over the world and today this dream is coming true. I am very proud of my team whose hard work has propelled us to this important milestone."
France-based Sequans recently celebrated its IPO and listing on the New York Stock Exchange in New York City on April 18 and today is celebrating at Euronext in Paris, Sequans' headquarters location. Sequans is the first French technology company to list on the New York Stock Exchange in more than ten years.
Approval qualifies Sequans to participate in large scale LTE trials of China Mobile
PARIS, France - September 14, 2011 -Sequans Communications S.A. (NYSE: SQNS) announced that its LTE semiconductor technology has been officially approved by China's Ministry of Industry and Information Technology (MIIT), a government entity responsible for the regulation and development of China's wireless industry. The approval signifies that Sequans' technology is qualified for use in LTE networks in China.
Sequans' LTE semiconductor solution has been undergoing testing for several months while interoperating with leading system vendors Huawei, and Alcatel-Lucent Shanghai Bell (Alcatel-Lucent's Chinese subsidiary). The successful passing of the tests indicates that Sequans' technology supports the MIIT performance and interoperability requirements necessary for the technology to be used in the field.
"We are very pleased to have the MIIT stamp of approval which we believe signals our readiness for worldwide deployment," said Georges Karam, Sequans CEO. "We have been working toward this ever since China Mobile asked us to provide technology for their first TD-LTE demonstration network at the World Expo 2010 in Shanghai, and we look forward to participating in the large scale trials and future commercial deployments of China Mobile and other LTE operators who now have confirmation of the maturity of Sequans' LTE solutions."
The MIIT performance and interoperability testing was conducted in both the 2.3 and 2.6 GHz bands. The chip used in the tests was Sequans' SQN3010 TD-LTE baseband chip. In addition to Alcatel-Lucent, and Huawei, Sequans has completed LTE interoperability testing on a private basis with Ericsson, Nokia Siemens Networks, ZTE and other network vendors.
The approval by the MIIT of Sequans' SQN3010 solution follows the chip's recent selection by NetComm, a device maker that recently announced it had been selected to provide TD-LTE devices for a major national LTE network in Australia.
BEIJING, China (PT ExpoComm China) - September 27, 2011 -Sequans Communications S.A. (NYSE: SQNS) and Huawei today jointly announced that they would begin a large scale trial in Shenzhen. This trial will be conducted on China Mobile's TD-LTE network deployed by Huawei, using devices based on Sequans' TD-LTE chipset. This is a significant milestone in the commercialization progress of TD-LTE.
China Mobile has selected leading equipment vendors to deploy TD-LTE trial networks in six major cities in China and Huawei has been selected for the city of Shenzhen. Huawei is responsible for building and deploying Shenzhen's TD-LTE network. Sequans recently became eligible to participate in the China Mobile trials when its LTE chip technology won official approval from China's Ministry of Industry and Information Technology (MIIT) after passing a battery of tests.
"We are very pleased to continue our long and successful cooperation with Huawei," said Georges Karam, Sequans CEO. "Working side by side with Huawei on interoperability over the last two years, we now have UE chipset technology that it is fully ready to support the important large scale trials of China Mobile as well as future commercial deployments."
Sequans and Huawei have already conducted several successful demonstrations of their TD-LTE solutions in collaboration with China Mobile, most notably at the World Expo 2010 in Shanghai and at the Asian Games in Guangzhou. For the trial in Shenzhen, Huawei will use TD-LTE USB dongles based on Sequans' SQN3010 TD-LTE chip.
State-of-the-art 40 nm chips deliver high performance and ultra low power consumption in a tiny package
PARIS, France - October 20, 2011 - 4G chipmaker Sequans Communications S.A. (NYSE: SQNS) today introduced three new FDD and TDD LTE baseband chips, a companion RF chip, and two new LTE platforms, supporting all global FDD and TDD LTE networks. The chips represent the state of the art in LTE semiconductor technology. They are designed in 40 nm CMOS process technology and deliver industry-leading low power consumption and high performance in a very small form factor. The new baseband chips, along with RF chips, reference designs and comprehensive software, comprise one of two platforms Sequans has designed to support two distinct market segments. The first platform, Andromeda, is customized for the design of handsets and tablets, and the second, Mont Blanc, is customized for the design of mobile hotspots, USB dongles and CPE modems.
"We are pleased and proud to offer these powerful, yet highly energy and cost efficient LTE platforms to our global customers," said Georges Karam, Sequans CEO. "These platforms are based on our second generation LTE technology, incorporating the latest advances in LTE semiconductor science and reflecting our many years of experience in 4G, working with operators and manufacturers all over the world. Our new LTE platforms are uniquely comprehensive, supporting all global TDD and FDD networks from 700 MHz to above 3.5 GHz, and designed to meet the needs of device manufacturers for all types of devices in the most efficient way possible."
All Sequans' next-generation LTE baseband solutions are designed in state-of-the-art, low-power, 40 nm process technology and include embedded SDRAM. They provide full support for all global FDD and TDD bands, are 3GPP R9 compliant, and deliver category 4 throughput of up to 150 Mbps. The chips feature Sequans' innovative low power consumption technology, developed over several years, which delivers ultra low power consumption in both idle and active modes. All chips are VoLTE-ready and delivered with complete LTE protocol stack and host software.
SQN3110 FDD/TDD LTE baseband system-on-chip. The SQN3110, part of Sequans' Andromeda LTE platform, is designed for the smallest of LTE mobile devices such as smartphones and tablets. It comprises an LTE baseband modem and SDRAM in a 10 x 10 x 1.04 mm package, optimizing both the footprint and the cost of LTE devices.
SQN3120 FDD/TDD LTE baseband system-on-chip. The SQN3120, part of Sequans' Mont Blanc LTE platform, is designed for mobile routers, CPE and hostless USB dongles. It comprises an LTE baseband modem, an integrated, customer-programmable applications processor, and SDRAM in a 10 x 10 x 1.04 mm package, optimizing both the footprint and cost of mobile routers, CPE and USB dongles.
SQN5110 FDD/TDD LTE and WiMAX dual-mode baseband system-on-chip. The SQN5110, part of Sequans' Andromeda LTE platform, is the industry's first single die, dual-mode WiMAX/LTE solution. It is the centerpiece of Sequans' 4Sight network migration and coexistence initiative, designed to facilitate a graceful transition for operators moving from WiMAX to LTE, and for device makers wishing to provide future-proof products. The chip comprises independent dual-4G basebands and embedded SDRAM in a 10 x 10 x 1.04 mm package, optimizing both the footprint and cost of dual-mode WiMAX/LTE devices.
SQN3140 RFIC for TDD LTE devices. The SQN3140 is an integrated, direct-conversion RF transceiver supporting major TDD bands. It is designed to combine with Sequans' Andromeda platform baseband chips, SQN3110 or dual mode SQN5110, and Mont Blanc platform baseband chip, SQN3120, to provide a total solution to manufacturers for a wide range of cost-effective TD-LTE end user devices such as smartphones, MIDs, tablets, routers, CPE, datacards, USB dongles, PCI Express MiniCards or Half MiniCards and more. The SQN3140 supports 3GPP LTE band classes 38 and 40-43 and WiMAX bands 2.3, 2.5, and 3.5 GHz. The SQN3140 includes embedded converters and delivers world-class RF performance in a 7 x 7 x 0.925 package.
Integrated third party RF for FDD LTE devices. As a complement to Sequans' SQN3140 RFIC and to ensure a total global solution for any and all LTE frequency bands not covered by Sequans SQN3140 RFIC, Sequans has established an agreement with Fujitsu Semiconductor whereby Fujitsu's 2G/3G/LTE RF solution (part number MB86L12A) is combined with Sequans' new LTE baseband solutions. The Fujitsu RF solution supports all major bands worldwide and will be pre-integrated and fully validated with Sequans' LTE chips by Sequans.
"Our LTE technology has been tested and proven in collaboration with nearly all of the world's leading system vendors in numerous networks on five continents," said Karam. "The robustness and maturity of our solutions has been established, along with our record for delivering cost-effective and high performance 4G semiconductor solutions to the market year after year. We are thrilled to unveil these new LTE solutions today and are confident that they will be recognized as the industry's most compact and cost-effective solutions for adding LTE connectivity to 4G devices.
Sequans' new LTE solutions will be available for sampling in December.
See Sequans at 4G World, McCormick Place, Chicago, October 24-27, booth 1819.
PARIS, France - October 20, 2011 -Sequans Communications S.A. (NYSE: SQNS) has established a technology and marketing collaboration with Fujitsu Semiconductor Limited for the purpose of providing customers with a comprehensive, high-performance LTE product offering that combines Fujitsu Semiconductor's multimode 2G/3G/LTE RF solution with Sequans' just-announced, next generation LTE baseband solutions. The Fujitsu Semiconductor RF transceiver supports all major global bands and modes, including LTE bands, and will be pre-integrated and fully validated with Sequans' LTE chips by Sequans.
"Our collaboration with Fujitsu Semiconductor ensures that our customers can adopt our LTE baseband solution to build devices for virtually any LTE spectrum band around the world," said Georges Karam, Sequans' CEO. "Furthermore, our mutual customers will benefit from this global multi-mode, multi-band solution in terms of cost efficiency and shorter time to market due to the pre-integration and validation work Sequans has completed on the combined solution."
The Sequans/Fujitsu Semiconductor combined solution features Fujitsu Semiconductor's MB86L12A 2G/3G/LTE RF CMOS transceiver and Sequans' SQN3110 and SQN3120 baseband chips. The MB86L12A supports all 3GPP LTE-FDD and LTE-TDD bands. The SQN3110 is Sequans' new generation 40 nm LTE baseband chip that is 3GPP R9 compliant, supporting category 4 throughput and providing extremely low power consumption in a very small footprint for handsets and the smallest of mobile devices. The SQN3120 adds an integrated applications processor for portable hotspots, hostless USB modems, and CPE devices.
"The Fujitsu Semiconductor MB86L12A features industry-leading RF LSI, and when coupled with the new LTE baseband from Sequans, will provide device manufacturers with a competitive LTE platform," said. Vivek Bhan, executive VP, Fujitsu Semiconductor Wireless Products, Inc. "Fujitsu Semiconductor is a leader in multi-mode, multi-band RF transceivers that reduce total radio BOM costs and customer's time to market for bringing versatile, worldwide roaming device solutions."
The Sequans/Fujitsu Semiconductor Wireless Products, Inc. technical collaboration will focus on ensuring that the combined platform solution is optimized and is fully verified, and that customers can quickly move through the design and prototyping stage into production. Each company will maintain separate responsibility for price, availability and support of its respective products included in the combined platform.
"Sequans and Fujitsu Semiconductor have worked closely to create a world-class solution that delivers not only global multi-mode, multi-band compatibility, but also high performance, low power consumption, and excellent cost-efficiency," said Karam. "Our partnership with Fujitsu delivers true value to manufacturers for a wide range of LTE-enabled devices, including smartphones, tablets, mobile hotspots, embedded modules, and more."
Reference designs for multiple device types based on the combined Sequans/Fujitsu Semiconductor LTE solution are expected to be available from Sequans beginning later this year.
PARIS-October 24, 2011-Sequans Communications S.A. (NYSE: SQNS), a 4G chipmaker supplying LTE and WiMAX chips to equipment manufacturers for mobile operators worldwide, today announced financial results for the third quarter ended September 30, 2011.
Third Quarter 2011 Highlights:
Revenues are in line with guidance; gross margin and non-IFRS earnings per share are better than guidance.
Revenue: Revenue of $26.2 million decreased 14% sequentially from the second quarter of 2011 and increased 39% compared to the third quarter of 2010.
Gross margin: Gross margin of 53.6% was higher than the gross margin in the second quarter of 2011, which was 46.6%, due mainly to the effect of product cost reduction during the quarter, combined with the impact of customer mix.
Operating income: Operating income of $1.9 million was the same as the second quarter of 2011, and increased 35% compared to the third quarter of 2010. Operating margin in the third quarter was 7.1%, compared to 6.2% in the second quarter of 2011 and 7.3% in the third quarter of 2010.
Net Profit: Net profit was $3.2 million, or $0.09 per diluted share/ADS, compared to a net profit of $0.1 million, or $0.00 per share/ADS in the second quarter of 2011 and a net profit of $0.8 million, or $0.03 per share/ADS in the third quarter of 2010.
Non-IFRS Net Profit: Excluding stock-based compensation and the change in the fair value of the option component of convertible notes, non-IFRS net profit was $2.8 million ($0.08 per diluted share/ADS), compared to a non-IFRS net profit of $2.8 million ($0.08 per diluted share/ADS) in the second quarter of 2011, and a non-IFRS net profit of $1.1 million ($0.04 per diluted share/ADS) in the third quarter of 2010.
|In millions of $US except percentages, shares and per share amounts || || ||Key Metrics |
| || || ||Q3 2011 || || ||%* || || ||Q2 2011 || || ||%* || || ||Q3 2010 || || ||%* |
|Revenues || || ||$26.2 || || || || || ||$30.6 || || || || || ||$18.9 || || || |
|Gross profit || || ||14.0 || || ||53.6% || || ||14.3 || || ||46.6% || || ||8.9 || || ||47.4% |
|Operating income || || ||1.9 || || ||7.1% || || ||1.9 || || ||6.2% || || ||1.4 || || ||7.3% |
|Net profit || || ||3.2 || || ||12.3% || || ||0.1 || || ||0.2% || || ||0.8 || || ||4.4% |
|Diluted EPS || || ||$0.09 || || || || || ||$0.00 || || || || || ||$0.03 || || || |
|Number of diluted shares/ADS || || ||35,089,236 || || || || || ||35,209,641 || || || || || ||26,426,760 || || || |
| || || || || || || || || || || || || || || || || || || |
|Cash flow from (used in) operations || || ||5.9 || || || || || ||(0.4) || || || || || ||(4.8) || || || |
|Cash and cash equivalents || || ||65.5 || || || || || ||61.9 || || || || || ||8.0 || || || |
| || || || || || || || || || || || || || || || || || || |
|Additional information: || || || || || || || || || || || || || || || || || || |
|Stock-based compensation included in operating result || || || || || || || || || || || || || || || || || || |
| || || ||1.3 || || || || || ||1.1 || || || || || ||0.3 || || || |
Change in the fair value of convertible notes option component included in financial result
| || ||(1.7) || || || || || ||1.7 || || || || || ||- || || || |
|Non-IFRS diluted EPS (excludes stock-based compensation and change in fair value of the option component) || || ||$0.08 || || || || || ||$0.08 || || || || || ||$0.04 || || || |
| || || || || || || || || || || || || || || || || || || |
|* Percentage of revenues |
"We achieved several important milestones during Q3, particularly in LTE," said Georges Karam, Sequans CEO. "Although the recent developments in the US WiMAX market will continue to affect us in the near term, we believe that they will have no impact on our long-term prospects. With our new LTE chips sampling in the fourth quarter, we expect LTE design wins to accelerate beginning in Q1 2012, for both the FDD and TDD markets, with the related revenues expected to begin ramping in the second half of 2012.
"In addition to the agreement we announced with Gemtek for the LTE market in India, during Q3, we announced an LTE win with Netcomm in Australia. We were one of the first chip companies to receive MIIT certification in China, which is required in order to participate in China Mobile's large scale trials. We also announced that we had begun our first large scale trial with Huawei in Shenzhen. This success is attributable to our early decision to place our initial focus on Asia with operators planning to deploy with unpaired (TDD) spectrum.
"A few days ago, we announced that our two new LTE platforms will be available in Q4. Both the LTE platform optimized for smartphones and the one designed for USB dongles and similar devices are based on an ultra-efficient modem design enabling superior performance, very low power consumption and an extremely small footprint. The three new baseband chips and a companion RF chip, plus seamless integration with Fujitsu's RF solution ensures that we can provide a complete global solution for all LTE frequency bands in both the TDD and FDD markets. Several OEMs and ODMs are preparing to ship products in 2012 using our new chips to serve operators in the U.S., Asia, Europe, Latin America and the Middle East.
"We will continue to focus on leveraging our time-to-market advantage by maintaining our LTE development efforts at the same pace and continuing to actively invest in our business. We remain confident of our strong position as a best-of-breed 4G chip supplier in a very dynamic and exciting market with abundant opportunities ahead."
PARIS, France - August 22, 2011 - 4G chipmaker Sequans Communications S.A. (NYSE: SQNS) has entered into an exclusive licensing agreement with NetComm Limited (ASX: NTC) to supply an advanced semiconductor solution for TD-LTE connectivity.
NetComm, a leading provider of high performance broadband communications devices, selected Sequans to provide the TDD-LTE semiconductor technology required for the development of LTE access devices designed to support the rise in LTE TDD operator trials, commitments and deployments.
NetComm recently announced that it was selected to provide LTE devices for a major national LTE network in Australia.
The agreement comes as a growing number of TD-SCDMA and WiMAX networks evolve towards TD-LTE, offering consumers and businesses significantly increased peak data rates and throughput; low latency; extended coverage and improved cell edge data rates.
"We are very pleased to collaborate with NetComm on delivering high performance 4G wireless devices to consumers," said Georges Karam, Sequans CEO. "Our LTE chipsets are designed to provide super high speed LTE connectivity with very high efficiency."
"We selected Sequans' LTE chips because Sequans has a wealth of experience in TDD-LTE technology and solutions," said David Stewart, Managing Director, NetComm. "Sequans has conducted in-depth LTE interoperability testing with leading LTE equipment suppliers, and we welcome this partnership."
NetComm designed and built LTE devices are based on Sequans' SQN3000 series 3GPP R8 compliant LTE technology that supports up to 100 megabits per second of throughput.
PARIS, France and KUALA LUMPUR, Malaysia - July 21, 2011 - 4G chipmaker Sequans Communications S.A. (NYSE: SQNS), Southeast Asia's first and leading 4G operator, Packet One Networks (Malaysia) Sdn Bhd (P1), and global 4G networking solutions provider, Greenpacket, are working together to develop LTE solutions, including dual-mode 4G WiMAX/LTE solutions for Greenpacket's global operator customers, including P1, its operator subsidiary in Malaysia. Greenpacket is testing Sequans technology to develop LTE and dual-mode WiMAX/LTE reference designs as part of its strategy to launch a complete ecosystem of 4G networking solutions and devices by the end of 2011.
"We are testing Sequans' system-on-chip technology to develop LTE reference designs, including a dual-mode WiMAX/LTE reference design for our operator customers primarily in Asia, CALA and Middle East," said, James Wang, Senior Vice President of Innovation, Strategies and Development (ISD) at Greenpacket. "We intend to offer our solutions to early adopters of LTE such as P1 in support of its LTE/WiMAX coexistence strategy."
"As Southeast Asia's leading 4G operator, first for WiMAX and now for dual-mode WiMAX and LTE, P1 has three years of experience operating an end-to-end 4G network," said Michael Lai, P1 CEO. "The insight we've gained regarding live 4G user behavior patterns is extremely valuable in LTE development, be it devices, network or applications. We are collaborating with Sequans because of Sequans' operator-proven WiMAX and LTE chipset technology and because of the company's real-world experience in deploying operator-certified 4G technology in high volume around the world."
P1 launched its WiMAX service in Malaysia in August 2008 and is now preparing to transition to LTE. P1 earlier announced its strategic direction to harness the power of both WiMAX and LTE, due to developing global LTE momentum, expects to begin a transition to a full LTE network in 2013.
The technology Sequans is providing to Greenpacket and P1 for testing is part of Sequans' recently announced 4Sight program, a collection of advanced coexistence technologies and solutions for operators to help them transition smoothly and cost-effectively from WiMAX to LTE and enable harmonious WiMAX/LTE coexistence. Sequans develops and supplies WiMAX and LTE chips including a highly integrated WiMAX/LTE dual-mode chip, along with reference designs for user devices, essential multi-radio coexistence and multimode handover technologies, and dual-standby architecture.
"Greenpacket and P1 are taking a leading position in the 4G world by establishing a dual-4G network while they transition to LTE and this will benefit not only P1 and its customers, but also other operators who adopt this strategy," said Georges Karam, Sequans CEO. "P1 now has the flexibility to rollout LTE at the rate they choose and have it coexist peacefully with WiMAX, and P1 customers will have devices that work in any part of the network at any time."
P1 continues to make progress in building out its 4G network and expects to have 65 percent of the population covered by the end of 2012.
PARIS, France, June 14, 2011 - 4G chipmaker Sequans Communications (NYSE: SQNS) and Gemtek, a leading manufacturer of broadband wireless solutions, have collaborated in bringing a new TD-LTE desktop CPE to market. Gemtek has developed the CPE, based on Sequans' LTE UE chip, for large-scale operator trials in India and for subsequent commercial deployments.
"Sequans has been working with Gemtek for many years on 4G device development and we are pleased to continue our work with them on new LTE devices," said Georges Karam, Sequans CEO. "Gemtek has a reputation for delivering cost-effective, high performance devices to mobile operators and here they have delivered a sleek and powerful LTE device that is very well-designed for desktop usage."
Gemtek's new TD-LTE indoor CPE is based on Sequans' SQN3000 series LTE SOCs, which support up to 100 Mbps throughput and 20 MHz channels, and comply with 3GPP standards. The device also features web-based configuration and supports VOIP and WiFi.
"We expect the new CPE to begin commercial deployment in the third quarter of 2011," said James Ting, GM, Broadband Wireless Business Unit, Gemtek. "In the coming months, we intend to bring to market additional LTE devices based on Sequans chips, including an outdoor CPE and a USB dongle."
Ultra small Wi-Fi/WiMAX router adds 4G connectivity to smartphones and tablets
PARIS, France - June 29, 2011 - 4G chipmaker Sequans Communications S.A. (NYSE: SQNS) is the provider of the 4G chip inside the new "mini Egg" pocket router now available from Korea Telecom. The unique device, about the size of an egg, enables users to easily add 4G connectivity to smartphones and tablets via a tiny mobile router that fits in a pocket. IGI Mobile, a leading Korean maker of wireless broadband communications devices, manufactured the device.
"We are very pleased to work with IGI Mobile to deliver this powerful 4G product to the Korean marketplace," said Georges Karam, Sequans CEO. "The design is modern and compact, and it provides great value for users, allowing them to add 4G speed instantly to almost any mobile device."
"Sequans' technology has helped us to make a tiny mobile router that is about half the size of the previous version," said Daniel Park, CEO, IGI Mobile. "Sequans' very small SQN1220 chip solution and its ultra low power consumption technology allowed us to reduce the package and battery size significantly while delivering hours of continuous WiMAX surfing and overall a very high performance 4G router."
The mini Egg (KR-MR100) is available today from Korea Telecom.
NEW DELHI (India Telecom) - December 8, 2011 - 4G chipmaker Sequans Communications S.A. (NYSE: SQNS) announced that Telenet Systems, a Mumbai-based designer and manufacturer of communications products, will build TD-LTE USB dongles and desktop CPE based on Sequans' new generation LTE semiconductor solutions. The new devices will be used in TD-LTE operator trials and commercial deployments coming soon in India.
"Sequans' new LTE solutions incorporate the latest advances in LTE semiconductors," said Nita Mehta, managing director, Telenet Systems. "The highly integrated Sequans' LTE chips provide us with key features, such as an integrated applications processor, that enable us to design and deliver high performing TD-LTE devices to operators and consumers in India."
Telenet is using Sequans' SQN3120 LTE baseband chip and SQN3140 TDD RFIC to design the new products. The SQN3120 is part of Sequans' new generation Mont Blanc LTE platform, which is designed especially for use in USB dongles and CPE. The SQN3120 is built in 40 nm, low power CMOS process and includes an integrated customer-programmable applications processor and SDRAM in a very small 10 x 10 mm package. It is 3GPP R9 compliant, delivering up to 150 Mbps of throughput. The SQN3140 RFIC is an integrated direct conversion RF solution built in 40 nm CMOS and delivered in a 7 x 7 mm package.
"The launch of 4G TD-LTE service in India is imminent as numerous operators launch trials and head toward full commercial deployment in the coming months," said Georges Karam, Sequans CEO. "We are very pleased to contribute our technology to Telenet and to help accelerate this exciting momentum."
See Sequans at Telecom India, December 7-9, hall 10, booth 13.
PARIS, France - December 15, 2011 - 4G chipmaker Sequans Communications S.A. (NYSE: SQNS) is providing the LTE semiconductor solution for customer devices for SKY Brasil's TD-LTE network that launched December 13 in Brasilia. SKY Brasil's network is the first LTE network in Brazil and Brasilia is the first city to receive service in what will become a nationwide broadband network. SKY Brasil, a subsidiary of DirecTV, was founded in 1996 as a direct broadcast satellite service provider and last year won a license to provide LTE service in Brazil in the 2.5 GHz band. Sequans has long experience in TD-LTE with its technology operating in TD-LTE trial networks since May of 2010.
"SKY's mission to build a nationwide LTE network is truly groundbreaking," said Georges Karam, Sequans' CEO. "It will benefit Brazilians tremendously, bringing advanced high speed connectivity to millions, and we are honored to contribute our technology to such an important project."
"Sequans has a wealth of experience in TD-LTE technology and one of the most mature TD-LTE solutions available today," said Isidoro Ferret, broadband director, SKY Brasil. "Sequans' TD-LTE technology has been proven interoperable with all the leading LTE equipment suppliers and its robustness clearly established. We are pleased to have Sequans' technology in our network."
The consumer device SKY Brasil is offering its customers is an indoor desktop unit that supports LTE, Ethernet and Wi-Fi. It is based on Sequans' SQN3010 TD-LTE chip that is 3GPP R8 compliant, capable of delivering up to 100 megabits per second of throughput.
PARIS - December 19, 2011 - 4G chipmaker Sequans S.A. [NYSE: SQNS] is the provider of the WiMAX chip inside the new WiMAX tablet recently made available by Sharp for its customers in Japan.
"Sharp's tablet combines the latest features for usability and mobility in a perfect seven-inch size and we are pleased to contribute our WiMAX technology to this highly advanced product for Japanese consumers," said Georges Karam, Sequans CEO. "With WiMAX, users can download videos, play games and surf the web at super high speed."
The new Sharp tablet provides WiMAX, and Wi-Fi connectivity. It carries a high-end platform the same as in 10-inch tablets, but comes in a slim and handy 7-inch size. It combines Sharp's advanced technology and beautiful display with Google's Android 3.2 (Honeycomb) platform and features a dual-core CPU and dual cameras.
"Sequans' WiMAX chip technology is optimized for tablets and handsets and delivers all the advanced capabilities of WiMAX with very low power consumption," said Masayuki Hachinoda, Division General Manager, Media Tablet Business Center, Communication Systems Group, Sharp. "The excellence of Sequans' semiconductor solutions combined with their long and successful track record in 4G are the reasons we selected Sequans' technology for this new tablet design."
The WiMAX chip inside the Sharp tablet is Sequans' SQN1210, one of the most highly integrated semiconductor solutions in the industry. The SQN1210 is highly optimized for mobile handsets, delivering baseband and triple band RF integrated in a single, 65 nm die for ultra low power consumption and ultra high performance at a very low cost. These innovations enable users to enjoy faster web browsing and smoother streaming media playback. The chip also features Sequans' patented dual transmit uplink technology, a technology pioneered by Sequans that can greatly improve coverage and performance.
The new Sharp tablet is now available to consumers through a leading WiMAX network operator in Japan.
PARIS, France - January 10, 2012 - 4G chipmaker Sequans Communications S.A. [NYSE: SQNS] announced that it is the provider of the WiMAX chip inside the new AAEON (an Asus company) TOUGH tablet PC recently unveiled by KDDI. The TOUGH business tablet, which recently became available to KDDI customers, is dual-mode, WiMAX and EVDO, incorporating AAEON's advanced technology, Google's Android 3.2 (Honeycomb) operating system and featuring a seven-inch display. The tablet is dust, water, and impact-resistant, suitable for the tough business environment. AAEON, an Asus company, is a leading manufacturer of industrial PCs.
"AAEON has delivered a powerful WiMAX tablet and we are very pleased to collaborate with them on this project," said Georges Karam, Sequans CEO. "The TOUGH tablet gives KDDI customers super high speed internet access with a beautiful display in a strong and sleek package."
"We chose to integrate Sequans' WiMAX chip in the TOUGH tablet because of Sequans' excellent track record in WiMAX semiconductor technology," said Dr. I.J. Lee, vice chairman, AAEON. "Sequans is inside some of the world's leading WiMAX devices and Sequans' chip is highly optimized for mobile tablets and handsets."
The WiMAX chip inside the AAEON TOUGH tablet is Sequans' SQN1210, one of the most highly integrated semiconductor solutions in the industry. The SQN1210 delivers baseband and triple band RF integrated in a single, 65 nm die for ultra low power consumption and ultra high performance at a very low cost. These innovations enable users to enjoy faster web browsing and smoother streaming media playback. The chip also features Sequans' patented dual transmit uplink technology, a technology pioneered by Sequans that can greatly improve coverage and performance.
The TOUGH tablet is the third Sequans-powered WiMAX device to launch on KDDI's network.
Gemtek's High Gain LTE USB Modem on display at Mobile World Congress
BARCELONA, Spain - February 27, 2012 - Gemtek, a leading provider of broadband wireless solutions, has built a new LTE USB modem based on Sequans' new generation LTE technology. LTE connectivity in the device is powered by Sequans' SQN3120 LTE baseband chip and SQN3140 companion RF chip, and the device is planned for use in global TD-LTE markets, including India, Latin America, Middle East, and Asia. Gemtek's new LTE USB Modem is the first of several LTE devices Gemtek will build using Sequans' LTE semiconductor solutions.
"Sequans' new SQN3120 LTE chip is highly efficient and flexible," said James Ting, GM, Broadband Wireless Business Unit, Gemtek. "It was an essential ingredient in building such a highly differentiated product as our new High Gain LTE USB modem. Using Sequans' chip, we were able to embed LTE in our design quickly and cost-effectively, and we are able to customize our products to support multiple bands and regions as desired."
The Gemtek High Gain LTE USB Modem combines LTE, Wi-Fi, and a high gain antenna in a compact desktop unit. It operates in TDD LTE bands 38, 40, and 41 and delivers LTE category 4 throughput of up to 150 Mbps downlink and 50 Mbps uplink, and 4 X 2 MIMO with transmit diversity for superior LTE performance.
"We are pleased to continue our long time collaboration with Gemtek on this powerful new LTE device," said Georges Karam, Sequans CEO. "Gemtek's new USB modem uniquely combines the portability of a USB modem with the high performance of a CPE, giving users superior and highly reliable LTE connectivity."
Sequans' SQN3120 is the baseband plus applications processor chipset at the heart of Sequans' second generation LTE platform, Mont Blanc, which is specifically optimized for the design of hostless USB modems, CPE, and mobile routers or hotspots. SQN3140 is Sequans' companion RF chip that operates in the major TDD LTE bands, 38, 40, 41, 42, and 43, and combines with the SQN3120 to provide a total baseband plus RF LTE solution. Mont Blanc comprises baseband and RF chips supporting global LTE networks, FDD or TDD, reference designs, and comprehensive software for a truly universal LTE semiconductor solution.
Gemtek's High Gain LTE USB Modem will be on display at Mobile World Congress in Barcelona, February 27 - March 1, in Gemtek's location (hall 2.1, stand 2.1C38) and Sequans' location (hall 2, stand 2G11).
LTE Mobile router, CPE, and USB modem on display at Mobile World Congress
BARCELONA, Spain - February 27, 2012 - Seowon Intech, a Korean manufacturer of consumer electronics devices, has produced three LTE end user devices based on Sequans' new generation LTE semiconductor solutions. The three new devices - a USB modem, an indoor CPE, and a mobile router - are based on Sequans' SQN3120 baseband SOC and SQN3140 RFIC. The new Seowon devices combine all the benefits of Sequans' SQN3120 chip, including high LTE throughput and low power consumption, with Seowon's unique design elements, resulting in highly functional LTE end user devices.
"We used Sequans' LTE chips for these new products because they are very efficient and compact," said Mr. J. Y. Kim, CEO, Seowon Intech. "We were able to add LTE connectivity to these new devices quickly and cost-effectively."
Sequans' SQN3120 is the baseband plus applications processor chipset at the heart of Sequans' second generation LTE platform, Mont Blanc, which is specifically optimized for the design of hostless USB modems, CPE, and mobile routers or hotspots. SQN3140 is Sequans' companion RF chip that operates in the TDD LTE bands, 38, 40, 41, 42, and 43, and combines with the SQN3120 to provide a total baseband plus RF LTE solution. Mont Blanc comprises baseband and RF chips supporting global FDD and/or TDD LTE networks, reference designs, and comprehensive software for a truly universal LTE semiconductor solution.
PARIS, France and SHENZHEN, China - April 18, 2012 - LTE chipmaker Sequans Communications has established a partnership with Nationz Technologies Inc., China's leading provider of RF chips and wireless communications solutions and products. The two companies are working together to develop TD-SCDMA / LTE solutions and products for LTE bands 7, 38, 39 and 40, specifically for the Chinese marketplace. The collaboration will yield unique multi-band, multi-mode devices of several types, including mobile routers, CPE, and USB dongles. Initial products will become available at around mid-year.
"Nationz is known for their design excellence in China and our collaboration with them is yielding valuable devices for Chinese consumers who will benefit greatly from dual-mode TD-SCDMA / LTE solutions," said Georges Karam, Sequans CEO. "China has been leading the way in TDD technologies, both TD-SCDMA and TD-LTE, and the new dual-mode Nationz/Sequans products represent a combination of best-in-class technologies and advanced feature functionality."
"We are pleased to work with Sequans, a leader in LTE chips and a company with long experience in China," said Bin Zhang, VP of Nationz. "Sequans' chips represent the latest and the most advanced in LTE baseband semiconductor technology. Combined with Nationz's RF and TD-SCDMA solutions, our products offer great value that will facilitate a seamless transition for Chinese consumers into the next generation of wireless."
Sequans' LTE semiconductor solutions support global LTE networks, both TDD and FDD, and are delivered with comprehensive software and reference designs for multiple device types for a truly universal solution. Sequans offers two LTE platforms: Mont Blanc, optimized for the design of host-less USB modems, CPE, and mobile routers or hotspots, and Andromeda, optimized for handsets and tablets. Sequans' LTE chips are compact and powerful, delivering category 4 throughput of up to 150 Mbps in a very small 10×10 mm package that includes SDRAM.
Nationz Technologies Inc. offers core RFIC transceivers (TRX) for next generation wireless technologies in the 1.2~2.8 GHz frequency range, covering dual-mode LTE/TD-SCDMA technologies. The RF chip solution integrates ADC/DAC and provides convenient digital I/Os for baseband chip connections. The chip shows very competitive performance, typically 1.8% of EVM at TX and 2.5% at RX with the MIMO feature enabled. Nationz provides the RF chip and the total solution including both evaluation boards and RF software drivers.
PARIS - April 25, 2012 - 4G chipmaker Sequans Communications (NYSE: SQNS) has become a participant in Verizon's LTE Innovation Center, created to empower LTE innovators and foster the development of new technologies for Verizon's world-leading 4G LTE network.
"We are very pleased to collaborate with Verizon Wireless and to participate in Verizon's LTE Innovation Program," said Georges Karam, Sequans' CEO. "The program is a catalyst for innovation and development and we are proud to be part of this group of leaders who have come together to help bring the world's best wireless technologies and products to market."
Sequans is a leader in the development of LTE semiconductor solutions and has recently released its second generation of LTE chip technology. These new solutions are built in 40 nm CMOS and are compact, efficient, and powerful, delivering category 4 throughput of up to 150 Mbps in a very small 10 x 10 mm package that includes SDRAM. Sequans offers two LTE platforms: Andromeda, optimized for the design of handsets and tablets, and Mont Blanc, optimized for the design of hostless USB modems, CPE and mobile routers.
Denver, CO, and Paris, France - May 3, 2012 - 4G chipmaker Sequans Communications (NYSE: SQNS) and Ubee Interactive, a leading manufacturer of broadband wireless devices for the global service provider market, announced that Ubee is building new LTE devices based on Sequans' second-generation LTE chip technology. Ubee is building several new Sequans-powered LTE devices, including USB dongles, mobile routers and desktop CPE, first for US LTE operators.
"We chose Sequans' LTE technology because of its efficiency and high performance capabilities," said Charles Kuai, CSO, Ubee Interactive and president, UbeeAirWalk. "We are building our LTE device portfolio and Sequans' technology enables us to design and deliver the highest performing LTE devices possible."
"The Ubee-Sequans collaboration will bring excellent end user LTE devices to market," said Georges Karam, Sequans CEO. "Ubee is a leading edge designer of 4G mobility solutions with some impressive designs in its portfolio. We are pleased that our technology enables Ubee's hostless design strategy and we are pleased to work with Ubee to expand their portfolio with these new LTE designs."
Ubee Interactive continues its growth in mobile broadband, expanding into 4G LTE as a complement to its successful 4G WiMAX deployment. First launched in the United States and now going global, Ubee is bringing to market LTE devices in USB, mobile router and residential service form factors. Ubee's industry leading "hostless" software is also part of the Ubee LTE device roadmap, which allows users near instant access to the Internet without the use of a traditional hosted connection manager.
Sequans' second-generation LTE semiconductor solutions support global LTE networks, FDD and/or TDD, and are delivered with comprehensive software and reference designs for multiple device types for a truly universal solution. Sequans offers two LTE platforms: Mont Blanc, optimized for the design of hostless USB modems, CPE, and mobile routers or hotspots, and Andromeda, optimized for handsets and tablets. Sequans' LTE chips are compact and powerful; delivering category 4 throughput up to 150 Mbps in a very small 10×10 mm package that includes SDRAM.
Companies to Work Closely on Performance Testing and Prototyping of TD-LTE Devices
PARIS, France and BELLEVUE, Wash. - May 7, 2012 - 4G chipmaker Sequans Communications S.A. (NYSE: SQNS) and Clearwire (NASDAQ: CLWR), a leading provider of wireless broadband services, today announced an agreement to collaborate on LTE for the purpose of accelerating the availability of LTE devices for Clearwire's planned TD-LTE network and to optimize the user experience for Clearwire's customers. The two companies will work together on performance testing and certification, standards development, and the creation of devices to support multi-band, multi-mode TD-LTE and FDD-LTE solutions.
"Clearwire is a 4G leader with big plans for TD-LTE where it is establishing strategic partnerships around the world to develop and strengthen the TD-LTE ecosystem," said Georges Karam, Sequans CEO. "Continuing the successful relationship begun under their current 4G network configuration into TD-LTE makes perfect sense for our two companies. We are very pleased to continue our collaboration with Clearwire."
"As the chip provider for numerous market-leading smartphones running on Clearwire's current 4G network, Sequans has been a major enabler of our growth," said John Saw, Clearwire's Chief Technology Officer. "We are excited to work with Sequans to bring LTE devices to market while also ensuring that the user experience on our planned LTE Advanced-ready network is second to none. We look forward to leveraging our successful relationship with Sequans to develop a new wave of devices for our 4G future."
New technology implemented on Sequans' LTE chips can double network capacity
NEW ORLEANS - May 8, 2012 - 4G chipmaker Sequans Communications (NYSE: SQNS) has added new technology to its LTE chip platforms called Sequans AIR™ - Active Interference Rejection. Sequans AIR is an innovative interference mitigation algorithm implemented on Sequans' chips for LTE end user devices. Sequans AIR can increase throughput up to 3.5 times for users at the cell edge and can increase network capacity up to 2 times if all user terminals are equipped with Sequans AIR. Sequans AIR was co-developed with technology partner ArrayComm, an industry leader in multi-antenna signal processing.
"LTE spectrum is limited and interference is becoming an issue for operators as network traffic increases," said Bertrand Debray, Sequans CTO. "Although network-based interference mitigation techniques are specified in future releases of the LTE standard, these are not available today plus these are limited in how much interference they can remove. We designed Sequans AIR in response to this, and have developed a powerful interference solution that can be implemented on today's LTE networks for significant benefits to end users and network operators."
Sequans AIR is designed to work in any LTE network (TDD or FDD), regardless of eNode B, carrier frequency, or channel bandwidth. It works today on LTE Release 8 and 9 networks and will work on future Release 10 and 11 networks. Sequans AIR is designed into Sequans' latest LTE platforms: Andromeda for LTE handsets and tablets and Mont Blanc for hostless USB dongles, CPE, M2M devices, and mobile hotspots. Sequans AIR represents the latest advances in interference mitigation techniques and works by forming a receive beam toward the useful signal, and spatial nulls in the direction of interfering signals.
"Sequans AIR has been tested and proven at the system level and at the link level," said Debray. "It has been tested in numerous interference scenarios, using the various transmission modes of LTE, and even in the most challenging situations where there are numerous interfering signals to be rejected by only two UE antennas, the Sequans AIR receiver shows a significant gain, rejecting in some cases twice as much interference as the default receiver."
Sequans has published a white paper detailing performance results and describing the full benefits of the Sequans AIR technology. Click here to download Mitigating Interference in LTE Networks with Sequans AIR - Active Interference Rejection.
D2 pairs its mCUE® 4G software with Sequans' Andromeda LTE platform for a turnkey OEM solution for advanced mobile devices
Shanghai (Mobile Asia Expo 2012) and Santa Barbara, CA - June 18, 2012 - D2 Technologies, the market leader in embedded IP communications software platforms, is unveiling a new System on a Chip (SoC) solution for mobile 4G Voice over LTE (VoLTE) in partnership with Sequans Communications, one of the world's greatest innovators in 4G chipsets. The collaboration pairs D2's mCUE® 4G, a converged 4G mobile communications client for VoLTE and rich communications (RCS) video calling, with Sequans' SQN3110, the baseband chip at the heart of Sequans' second generation Andromeda LTE platform. The result is a complete, cost-effective turnkey design for OEMs and ODMs looking to bring mobile handsets, tablets, smartphones and other mobile devices to market that tap the speed and advanced capability of the LTE network - including VoLTE and RCS.
Visitors to the Mobile Asia Expo 2012, being held June 20-22 at the Shanghai New International Expo Centre in China, can get a first look at the new reference solution in Rohde & Schwarz's exhibition space (N1.E17) through live VoLTE calls via a Quanta reference tablet computer running through the R&S®CMW500 LTE and IMS communication tester.
"We are pleased with the results of our work with D2 that shows our VOLTE-ready technology running beautifully on D2′s mCUE VOLTE platform," said Georges Karam, Sequans CEO. "Voice over LTE is key for the future of LTE and collaborations like ours with D2 will soon make it a commercial reality."
The new joint solution successfully debuted at Computex Taipei earlier this month in demonstrations that also ran through the R&S®CMW500 LTE and IMS communication tester.
"D2 has a long history of successfully partnering with Sequans in interoperability tests and trials as well as with its earlier SoC products," noted Doug Makishima, chief operating officer for D2 Technologies. "The company is well known for its chipsets delivering high throughput and advanced QoS with low power consumption - all features that are necessary for OEMs to develop products that offer IMS-rich IP communications services. Together, we're offering customers a faster way to meet the rising consumer demand for 4G mobile devices."
New TDD CPE to launch on the network of Packet-1 Malaysia delivering uninterrupted user experience
PARIS and KUALA LUMPUR - June 20, 2012 - 4G chipmaker Sequans Communications (NYSE: SQNS) and global 4G networking solutions provider, Greenpacket, today introduced the industry's first 4G WiMAX and LTE TDD indoor dual-mode integrated access device (IAD) solution - DA 235. The first-of-its-kind dual- mode customer premises equipment (CPE) is specifically designed to support WiMAX operators who are currently making the transition to LTE networks, enabling them to deliver uninterrupted service to their users who can be connected to either WiMAX or LTE networks. This complete and unique device solution is powered by Sequans' dual mode semiconductor solution that integrates both WiMAX and LTE in a highly efficient, single die. Packet One Networks (Malaysia) Sdn Bhd ("P1"), Southeast Asia's first and leading 4G operator, will be one of the very first to deploy the new Greenpacket dual mode CPE in 2013.
The DA-235 is by far the most complete 4G home networking IAD that will revolutionize the next generation of wireless broadband. It has exceptional radio performance supported by adaptive MIMO A&B, switched transmit diversity (STD), maximal ratio combining (MRC) and integrated high-gain 5dBi omni antenna. These features intelligently work in perfect unison to deliver uncompromised coverage, consistency and predictable service experience. It is compliant with the latest LTE Category-4 (3GPP- R9) and WiMAX 802.16e-2009 standards, providing downlink and uplink speeds of up to 150 Mbps and 50 Mbps for LTE TDD and combined speed of 40 Mbps for WiMAX. Additional connectivity interfaces of Wi-Fi 802.11n, 1 LAN port and 1 RJ-11 port makes the DA-235 a perfect device to deliver quad play services allowing operators to live up to expectations of their 4G promise. The DA-235 is the first of Greenpacket's upcoming portfolio lineup of dual-mode LTE devices that will include a pocket modem, USB, and indoor and outdoor units that operate on standard WiMAX bands, 2.3, 2.5 and 3.5 GHz, and four main LTE TDD bands, 38, 40, 41 and 43.
"P1 is very pleased to make this uniquely powerful device available to our customers," said Michael Lai, P1 CEO. "It allows us to realize our dual-mode WiMAX and LTE co-existence and LTE migration strategies very cost-effectively with the best possible seamless experience for our customers. Most importantly, it enables P1 to roll out LTE at the right time towards the path of the next generation of 4G technology."
"P1 is a leader in establishing a dual-4G network and is successfully demonstrating its WiMAX to LTE migration strategy by using dual-4G devices, eliminating the need to replace devices as they build their LTE network and significantly reducing inventory risk," said Georges Karam, Sequans CEO. "This is a major cost benefit, and the same benefit can accrue to any WiMAX operator adopting a dual-mode strategy. We are very pleased that our technology enables this smooth transition."
"We are extremely excited to deliver this groundbreaking product. Greenpacket has yet again demonstrated its technology leadership in solving the biggest concerns faced by WiMAX operators globally in transitioning to LTE" said James Wang, Senior Vice President of Innovation, Strategies and Development at Greenpacket. "We have always been supportive of the WiMAX operator community needs and we will continue to take the lead in providing the best-in-class products that withstands technology transitions and well suited to the lifestyle of today's consumers."
The chip powering the Greenpacket dual-mode CPE is Sequans' SQN5120, part of Sequans' second-generation Mont Blanc LTE platform that is optimized for CPE, USB dongles and mobile routers. It is dual mode WiMAX/LTE, built in 40 nm CMOS, is 3GPP R9 compliant, supports both TDD and FDD for global compatibility, and comes in a very small 10×10 mm package that includes SDRAM. The SQN5120 is the world's first and world's only single die, dual-mode WiMAX/LTE semiconductor solution.
SQN5120 is the semiconductor component of Sequans' 4Sight program, a collection of advanced coexistence technologies and solutions for operators to help them transition smoothly and cost-effectively from WiMAX to LTE. 4SiGht includes dual-mode reference designs in addition to multi-radio coexistence and multimode handover technologies.
"The WiMAX Forum would like to congratulate Greenpacket, Packet-1, and Sequans on this important announcement," said Declan Byrne, acting president, WiMAX Forum. "We believe that WiMAX/TD-LTE multimode devices provide operators with a smart and economical solution to move forward with both WiMAX and TD-LTE in a cooperative way, alongside WiFi, 3G and WiMAX Advanced, to continue to deliver value to their customers."
PARIS - June 26, 2012 - 4G chipmaker Sequans Communications (NYSE: SQNS) announced that there are now 15 Sequans-powered mass-market 4G smartphones and tablets in use by consumers in four countries around the world. The latest is the HTC EVO Design, a 3G/4G smartphone, launched recently by Global Mobile, a leading WiMAX operator in Taiwan. The HTC EVO Design is now on sale and available in Taiwan through HTC stores as well as through Global Mobile.
According to Rosemary Ho, chairman of Global Mobile, the number of Global Mobile subscribers is expected to double by the end of the year due to the availability of the new HTC EVO Design.
"The 4G-enabled EVO Design is a beautiful smartphone with very high performance, powered by the most advanced WiMAX semiconductor technology from industry leader, Sequans," said Rosemary Ho. "We are very pleased to make this superior 4G WiMAX smartphone available to our customers."
"WiMAX continues to add subscribers, is featured in some of the world's most advanced devices, and is delivering high speed wireless to 4G-hungry users around the world," said Georges Karam, Sequans CEO. "Sequans remains the leader in WiMAX chips and we are very proud to provide the WiMAX connectivity for some of world's most iconic 4G smartphones and tablets such as the HTC EVO Design."
Sequans-powered WiMAX smartphones and tablets are now available from seven operators around the world, including Global Mobile and Vee Time in Taiwan, KDDI in Japan, Korea Telecom in Korea, and Sprint, Virgin Mobile, and Boost in the USA.
The HTC EVO Design features a 4-inch super LCD screen, capacitive touchscreen, 5MP camera, virtual QWERTY keyboard, and 2G/3G/WiMAX connectivity.