Replies to post #150037 on Lightwave Logic Inc (LWLG)

[prototype_101]

IMEC connection >>> Van Campenhout notes, however, that future use cases require SiPh to introduce new materials, to keep making improvements in performance and cost. For example, as the signal rate in data center transceivers grows beyond 200 Gb/s, realizing enough modulator bandwidth with acceptable light losses becomes challenging. Such roadblocks can only be removed by introducing new materials into the mix. “Enriching SiPh with new materials and new functionality while maintaining maximum CMOS compatibility represents a great opportunity.”

https://www.imec-int.com/en/articles/silicon-photonics-piggybacking-decades-chip-manufacturing-experience