Texas Instruments Inc (TXN)

[Eric]

TI at 3GSM World Congress

"Six of the top seven 3G handset manufacturers use TI 3G technology in over 45 models shipping today. With more than 50 percent of the UMTS semiconductor marketplace, TI has won the first wave of 3G designs. By continuing to work closely with our customers and mobile operators, and with this new technology for 3G products, TI is also positioned to win the next wave of 3G designs by bringing 3G handsets to the masses at an attractive price point. TI's technology will fuel this growth and provide choice in the marketplace." - Gilles Delfassy, SVP of, TI's Wireless Terminals Business Unit, Cannes FR, February 14, 2005 -

At 3GSM TI announced the OMAP-Vox GSM/GPRS/EDGE/UMTS chipset family, which merges a 3G modem and applications processor, into existing OMAP architecture taking their 3G chipset from custom built products (for the likes of Nokia and EMP), through migration to a standard product, and then through to a single chip standard product.

Built on TI's successful OMAP processor technology, the OMAP-Vox family of solutions merges both modem and applications functionality onto the existing OMAP architecture. Additionally, these solutions share a common software platform that can be re-used for a variety of growing market requirements, thus saving manufacturers years of software design effort and bringing overall development costs down.

A 2.5G version, the OMAPV1030 GSM/GPRS/EDGE chipset -- is already sampling.

http://tinyurl.com/5o8f9

http://focus.ti.com/pdfs/wtbu/TI_omapv1030.pdf

http://focus.ti.com/docs/pr/pressrelease.jhtml?prelId=sc05048

• To provide OMAPV1030 customers with a logical modem roadmap from GSM/GPRS/EDGE to UMTS and HSDPA, TI is developing additional OMAP-Vox solutions designed specifically to address the cost-optimized, feature phone and smartphone UMTS market segments.

• OMAP-Vox solutions for UMTS are expected to sample in 2005.

•Customers using TI's [ARM11 based] OMAP 2 applications processors will be able to migrate their applications software to future smartphone OMAP-Vox solutions.

At a very high level this is TI's 3G chipset roadmap:

http://focus.ti.com/pdfs/wtbu/TI_wireless_brochure.pdf

• Second-generation [ARM11 based] OMAP 2 processors are transforming mobile handsets further into essential mobile entertainment and productivityboosting devices. Designed for the multimedia-intensive demands of 3G, OMAP 2 processors combine consumer electronics-quality applications into the small footprint of a mobile handset for the ultimate 3G experience.

>> TI Sees HSDPA Reality by 2006

3GSM Daily MCI NewsFeed
16 February 2005

http://tinyurl.com/5hgk9

Chipset vendor Texas Instruments forecasts that HSDPA networks will have launched commercially within 2006, following rapid uptake of 3G services by the mass market. At the 3GSM conference in Cannes today, the company said it forecasts up to 1 billion users of 3G handsets by 2015. In order to stimulate such growth, TI today unveiled the OMAP-Vox GSM/GPRS/EDGE/UMTS chipset, which merges a 3G modem and applications processor into existing OMAP architecture. Deepu John, senior product marketing manager of cellular systems for TI, said that this was a key part of the process for taking the 3G chipset from a custom built product, through migration to a standard product and then through to a single chip. This final stage giving 3G architecture its smallest form factor and cutting down dramatically on handset development time through the correlation of hardware and software. <<

- Eric -