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Re: Pro_v12001 post# 205533

Monday, 11/25/2024 5:39:33 PM

Monday, November 25, 2024 5:39:33 PM

Post# of 219798
Thanks Pro-V,

IMO this is a series of critical articles explaining how the industry is reinventing itself by combining electronics and photonics.

During the PECC meeting in October, we heard several companies - incldg NVDA...- demanding progress in terms of packaging and testing.
The part 2 of the link you provide goes into a very interesting discussion of how, after developing and making sure single "sections" or "chiplets" of devices have been proven to work individually, the industry - IMEC is a research leader in the field and LWLG has been working with them for a long time - is in the process of publishing new standards for more efficient, scaled up methods of testing the different parts after they have been integrated in 2.5D or 3D fashion.
Link: https://www.imec-int.com/en/articles/chiplets-piecing-together-next-generation-chips-part-ii-0

M Lebby makes a reference in his last 3Q24 update of how the work with their selected T1 partners is progressing towards commercialization in several ways - different ways to integrate the EOP modulators-, including the way some leading transceiver manufacturers are asking them to provide modulating chiplets.for the most significant size and power consumption breakthroughs ..

Once again, thanks for sharing this very interesting article...

It's happening right under our eyes,

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