Lightwave Logic Inc (LWLG)

[prototype_101]

Hybrid PICs: Pioneering New Frontiers in Photonic Integration

High speed, low power, tiny modulators in a polymer PIC platform are poised to enable 800G/1.6Tbps data communications, driven in part by artificial intelligence.
The issue of reducing power consumption, increasing information in optical networks in a datacenter rich environment has become a huge topic of discussion at major optical communication conferences, and industry in general. Ultra-high speed, ultra-low power modulators, ultra-small foundry-based polymer modulators are seen to be an enabling technology that can help mitigate power consumption in transceivers, line cards, servers, and routers. This is especially the case where the appetite for artificial intelligence, machine learning is driving huge investments for higher performance datacenter equipment/cap ex. Electro-optic polymer modulators are now poised to address power consumption with their inherent ultra-high speed and very low power properties (>70GHz EO S21 3dB bandwidths, and sub 1V drive voltages). Electro-optic polymers are now additive with silicon foundries to integrated photonics platforms such as silicon photonics to increase performance significantly. The latest performance of polymer modulators will be reported that aligns very well with 800G and 1.6Tbps transceiver technology. This talk will also review the latest work in photonics industry decade roadmaps (that look out to 2030-2040) on both the integrated photonics (PIC) level for hybrid PICs, as well as PIC packaging level for the various technologies to package hybrid PICs.

https://picinternational.net/speakers

Game over Shorts!!! You lose!!!!