Lightwave Logic Inc (LWLG)

[theroc66]

Proto,
Not only more than half the names you posted below meet at OIF to setup the next round of Co-packaged standards, but may I remind you that they also are part of that Global Foundry-driven ecosystem named Fotonix, which uses a 300mm 300GHz-class RF-CMOS silicon wafer enabling the "highest level of integration on a PIC (...) for faster, more efficient transmission of Data, with better (10,000X better) system error rate".

And as you clearly point out, in the interview, Dr Lebby is quoted as saying:
"... If the co-packaged optical module that gets really close to the electrical switch chip is small enough that it could fit into a pluggable form factor, as well, whoever makes those modules gets a double win.”
Will 30X smaller than a TFLN-based modulator fit the bill ?!?

I very much think so!

And since the March of 2022 Fotonix announcement, we know that products releases will be announced 2H2023 for a 2024 ramp up. Remind me again who is using the same timeframe since their May 2022 Shareholders Meeting??

Oh yeah, Long and Strong! Stronger than ever! And for a very Long time! "Decades to come"??

GLTAL
AR.