$GTCH the company is broadening its 3D, multiplanar, integrated circuits design and manufacturing continuation patent application, responding to an United States Patent and Trademark Office (“USPTO”) office action. GBT will also seek to protect the original patent’s concepts focusing on semiconductor wafers mounting on vertical and horizontal planes. The original invention design presents a new way to design and manufacture larger size integrated circuits (ICs) to fit advanced analog, digital and mixed IC types on a silicon wafer. The technology that was subject to the patent sought to enable the advanced microchip design and manufacturing within significantly less space which can be a major factor for IC’s manufacturing, performance and cost. It is thought that the invention can be a game changer particularly for integrated circuits that require vast amount of silicon space like memories, CPU, GPU and AI. The Company’s 3D microchip patent was filed on March 5, 2019, and was granted as of December 1, 2020 by the USPTO; U.S. Patent No. 10,854,763. The continuation application, assigned number 17102928, was filed on November 24, 2020. The Company’s intent in filing the continuation is to broaden the protection of its main IP concepts. It is GBT’s goal to further develop advancements in this domain through the use of the 3D, multidimensional design, utilizing more space on the silicon wafer, enabling manufacturing of larger ICs, with higher performance, lower power consumption and cheaper.
