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tkg

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Alias Born 07/17/2013

tkg

Re: None

Thursday, 02/06/2020 5:27:49 AM

Thursday, February 06, 2020 5:27:49 AM

Post# of 201451
As impatient as I am, anxiously awaiting news regarding the reliability testing, I understand it takes time to play out. As ML said, the big players want data, data and then more data.

Delivering the Next Billion-Unit Computing Platform Requires Industry Collaboration
by Kevin Moraes
Jan 31, 2020

_____________________

“Apart from performance, I think there are two other things which EUV is not going to solve,” added Bala Haran, Master Inventor and Director of Silicon Process Research at IBM Research. “One is reliability. Especially for high-performance compute, reliability is extremely important. And that's a materials challenge. The other is routability. Design routability improves with EUV, but it's not completely solved.”

______________________

In order to address the PPAC requirements of a diverse set of applications, Applied Materials believes the industry needs a new playbook for semiconductor design and manufacturing. This new playbook involves a combination of approaches including new system architectures, new 3D structures, new materials, new ways to shrink transistors and new ways to connect chips together with advanced packaging.

http://blog.appliedmaterials.com/next-computing-platform-requires-industry-collaboration

I sincerely hope ML is talking to AMAT!
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