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Saturday, 03/02/2019 12:31:47 AM

Saturday, March 02, 2019 12:31:47 AM

Post# of 6437
Proto, I shared your good news on Agora.

Check this out all. March 26 panel discussion, Schmidtke- Facebook, Blum -Intel et al

Summary

PIC devices offer size, performance and energy advantages that have enabled rapid growth among optical component manufacturers while encouraging entrants offering new and novel insights. End users need high levels of consistent quality--the hallmarks of CMOS device fabrication--while process tool, assembly and test automation experts strive to support the unique requirements of PIC module TAP. Today’s PIC-based transceivers or PIC transceiver components are often assembled, packaged and tested manually. Is it possible to drive demand while the infrastructure needed to support it is still being conceived, designed and built?

Seems to me POET's chip scale integration and wafer scale assembly and test may be the perfect solution.
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