This is a great way to start this thread. This is a letter from Kent Kloock" father after he visited NPCT Germany.
From: Arnold Kloock
To: Kent Kloock
Sent: Wednesday, August 02, 2000 4:55 PM
Subject: NanoPierce Card Technologies GmbH
On Monday, 1 August 2000, I was picked up at my hotel in Munich by a taxi
sent by NanoPierce Card Technologies GmbH. The ride in an Audi was the
beginning of an exciting day. The driver didn't spare the engine as he drove
the 15 or so kilometers from downtown Munich to the suburb of Hohenbrunn, the
location of NanoPierce Card Technologies GmbH
I entered the building and went to the second floor and introduced myself to
Mr. Bernhardt Maier, who is in charge of sales and marketing, and Bernhardt
introduced me in turn to Michael Kober and Karl Heinz Kuhn. Thanks to the
taxi driver's speedy delivery I was a bit early for our meeting. Mr. Maier
took me into a conference room which was well supplied with a pot of very
good coffee as well as other refreshments. I indulged in a cup of coffee as
Mr. Maier completed his activities and started a four hour session describing
NanoPierce Technologies, along with some personal statements, and a dinner at
a 400 year old hunting lodge having excellent fare.
The second floor has several rooms serving as offices, reception, conference,
laboratory, computer, storage and other. Some rooms appeared to be somewhat
empty aside from use for equipment storage and because they are attempting to
hire more personnel. I was told that they have advertised in local,
national, and world publications with little success in hiring a receptionist
and assistant with the proper qualifications and willingness to relocate to
Hohenbrunn. I was told that there was to be another employee entering the
company on 2 August 2000.
The laboratory contains some bonding and test equipment to determine the
integrity of the bonding process of chips into the cards. Both super glue
and hot melt glues are used. Two sides of the laboratory were open tables
waiting for more test equipment. I was told that the equipment was ordered
and delivery was expected shortly.
In the conference room Mr. Maier presented a very good picture of NanoPierce
as a company that has a process that would greatly improve the reliability of
contacts, as well as eliminate the use of lead in the solder for the now
common bonding process. He is very forward in his attitude that the process
has a great future because of its nature.
Mr. Maier showed me several photographic transparencies made by Dr. Wernle
dated January 2000. The transparencies were obviously designed to make a
favorable impression of the NanoPierce contact process. They also showed a
projection for the future five years of improved usage of the NanoPierce bond
process.
Although I did not meet Dr. Wernle, I believe I experienced his attitude for
a well run company in which all employees get along well with each other and
have great respect for each other. They believe in the process and have a
definitely positive attitude towards the future of NanoPierce Technologies.
The future shows definite plans for a production system by the end of next
year. In the present they have visited several French companies and one
company has visited them for a possible contract. This is not now set in
concrete but very promising. They are also looking for other companies to
share the process.
Ironically, later in the afternoon, a local tour guide not connected with
NanoPierce stated to me "that Munich is known as the chip center of the
future and is approaching that status fast."
Dad
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