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Cool, Thx SS
Jim Theodoras, VP R&D at HG Genuine will be attending this EPIC mtg.
EPIC Online Technology Meeting on Commercial Challenges for Photonics as 5G Booms (in cooperation with COBO & EA)
25 January 2021 15:00 – 17:00 CET
https://www.epic-assoc.com/epic-online-technology-meeting-on-commercial-challenges-for-photonics-as-5g-booms/
List of registered exhibitors for EPIC event Feb. 17-18
https://photonicsplus.com
4D Lidar...
1/5/21
Two former Apple insiders are building a laser technology startup to fuel the electric car boom
https://finance.yahoo.com/news/two-former-apple-insiders-are-building-a-laser-technology-startup-to-fuel-the-electric-car-boom-191151951.html?.tsrc=fin-srch
@EPICassoc 30m
New EPIC member Photosynthetic is creating a polymer-based 3D printer capable of generating 3D structures with sub-micron resolution at unprecedented speed. http://photosynthetic.nl
Interesting comment on CNBC by the auto analyst from Roth Capital just now when speaking on TSLA
"as far as chip technology, they've got optical chips coming that will outperform existing optical chips by a factor of 10"
".... what about Microsoft?"
Microsoft reportedly designing its own ARM-based chips for servers and Surface PCs
A warning shot to Intel
By Tom Warren@tomwarren Dec 18, 2020, 3:54pm EST
https://www.theverge.com/2020/12/18/22189450/microsoft-arm-processors-chips-servers-surface-report
Intel To Face Challenging 2021 Amid Activist Investor's Call For Change, Morgan Stanely Says.
09:05 AM EST, 12/30/2020 (MT Newswires) -- Intel (INTC) is set to face a challenging 2021, with concerns in the manufacturing of its new processors amid an activist investor recently calling for change, Morgan Stanley said Wednesday.
Recently, Third Point Chief Executive Daniel Loeb wrote a letter to Intel Chairman Omar Ishrak, asking the company to evaluate strategic alternatives and make changes within the company, Reuters reported. Intel then said it will work with the activist investor to enhance shareholder value.
In a note to clients, Morgan Stanley analysts said Intel's management and board have shown that they can objectively be open to feedback, which could be helpful especially with a relatively new chairman of the board.
However, the bigger question, the analysts said, is how much fabrication capacity Intel should outsource for manufacturing its 7 nm processor. The analysts have said that numerous delays in the manufacturing technology for both the 10 nm and 7 nm processors have been a "significant impediment" to the company. Outsourcing manufacturing to Taiwan Semiconductor Manufacturing would likely be accretive to Intel's margins and cash flows, Morgan Stanley said.
Another challenge is the lack of visible technology decision-makers in the company. The analysts said the departure of chief CPU designer Jim Keller and Chief Engineering Officer Murthy Renduchintala has affected investor and customer confidence.
"Investor confidence is important, but customer's confidence in the roadmap is even more important and Intel needs someone in the executive suite that can talk to those issues, in addition to strong financial management," according to the note.
Morgan Stanley reiterated its equal-weight rating on the stock, with a price target of $60.
Price: 49.09, Change: -0.30, Percent Change: -0.61
For those who may not be aware...Michael Lebby Linkedin...
Director Business Development/Investor (with Board observer positions on investments)
Company Name Intel Capital
Dates Employed1999 – 2001
Employment Duration2 yrs
Intel Capital, Santa Clara, California. In 1999, Lebby joined Intel as a corporate investor and was responsible for sourcing, negotiating, and closing private placement equity deals in the optical networking, component, and semiconductor arenas. Lebby served as Intel’s board observer on a number of photonics based start-ups. Lebby was one of the co-founders of Intel's photonics division in the year 2000.
CES registration is now open @CES·Dec 22.@BradSmi(th), President of @Microsoft, is headed to CES to discuss the promise and peril of the digital age.
JANUARY 11-14, 2021
Only at #CES2021 https://bit.ly/3nJzLNU
10:06:50 .91 28,236
"Unlike conventional modulator materials, the EO active polymer material system is naturally fast. Lightwave Logic, Inc. for example is designing commercial high-speed optical modulators made from electro-optic polymers that will be capable of 100 Gbaud both at 1550nm as well as 1310nm. The addition of 1310nm will allow the polymer platform to impact both very short reach optical interconnects as well as medium and long reach fiber optic interconnects.
Vario-optics is a Swiss company manufacturing polymer passive waveguides for fiber communications, and the combination of both active and passive polymers offers active roadmap possibilities for future generations of transceiver performance. Product development of 80GHz plus active polymer modulators is taking place today and these innovations align well with arrays of passive polymer waveguides for multi-channel solutions for next generation fiber optic transceivers.
IPSR-I ENABLING TECHNOLOGIES
The opportunity for very high analog optical bandwidths are feasible in the near future with active optical polymers. Already, low voltage and analog optical bandwidths of greateer than 100GHz have been achieved. EO active polymer material system also has the potential of for direct drive from CMOS chips, and may eliminate the need for high speed driver chips, which could save the end user money in the bill of materials for a system design.. Additionally, passive waveguide technology can be arrayed easily to allow for multichannel interface untis, as well as advanced co-packaging solutions as photonics becomes geographically closer to electronics for more efficient architectures in optical networking switches and routers."
______________
https://vario-optics.ch/applications/#PIC_Coupling
No credit to me, this is all Steve!
Polymer photonics will grow from up to 10 polymer devices per PIC presently, to over 500 devices per PIC over the next 20 years. The types of PICs that will implement polymers include transmitter that include both modulators, lasers, waveguides, WDMs, spot size converters, and detectors. The functions of these polymer PIC chips may include transmitter drivers, and arrayed transmitter drivers, both incoherent and coherent. Key applications for polymer based PICs include data communications and telecommunications. Within data communications, both datacenters, and high performance computing segments.
Thx SS
https://www.photonicsmanufacturing.org/sites/default/files/documents/front-end_polymer_materials_3.pdf
Thx and Happy Holidays to you and to all Lightwavians!
Glad your well proto...)
A post of yours from more than 3 yrs ago...
prototype_101 Wednesday, 07/26/17 07:01:57 AM
Re: None 0
Post # of 60978
LWLG >> Conservative Potential Buyout PPS estimates
IF, and I emphasize IF, a buyout offer were to BE EVEN ENTERTAINED by the LWLG BOD a MINIMUM OFFER >>
1) as of today's developmental progress & IP = PPS $3 to $5 (200-300 Million)
2) Beta 25Gbs proto & customer evals = PPS $5 to $10 (350-700 Million)
3) 25Gbs commercial & 50Gbs Beta = PPS $10 to $20 (700 Million-1.4 Billion)
____________
So your base case as to where the pps should be now is in the $3-$5 range based on development advances over the last 3 yrs? I'm curious where you see pps if a major player is announced and what would be your revised buyout scenarios 1) 2) & 3) ?
TIA for your valuable input!
Another blow to INTC, MSFT reportedly planning on making own chips...
INTC
47.60-3.05 (-6.01%)
As of 3:43PM EST. Market open.
A good analogy noblynx, just at my limit with the further testing will be needed statements. I've lost count how many times I've read that over 15 yrs of patience. Hate being a wet blanket this morning but the time for some pps appreciation is waaaay overdue.
A good read until I got to these comments...
"Lightwave Logic says the sealant has shown encouraging performance in tests; however, the company plans to continue development work to further optimize the sealant's properties to better enable chip-on-board designs."
________
"Lebby declined to place a timetable on when the technology would be ready for full commercialization."
Time to hibernate for the winter until the next "plans to continue development work to further optimize" headline...
Just give us a name for Christ's sake Michael!
Nice! Thx SS
I agree with you on all points, I'm just pleased with the fact that AMAT is acknowledging the photonics industry since they need skate to where the puck is going to be, so to speak. Huge AMAT fan too...)
"The growth in photonics applications will require addressing device technology challenges in performance, manufacturing, and system-integration."
"Today forces are driving demand for new process equipment that can not only resolve device performance challenges but also deliver superior process control and improve overall manufacturing yields."
https://www.appliedmaterials.com/nanochip/nanochip-fab-solutions/nov-2020/photonics
Applied Materials
@Applied4Tech· 1h ago
Applied’s Shiva Rai explains how various photonic device technologies enable emerging applications such as 3D sensing, optical interconnects, augmented reality & autonomous driving. Photons will add “vision” to the electronic “brains” of future machines.
My dream is for LWLG to have a nice long meeting w/ AMAT someday (soon)!
PHOTONIC DEVICE TECHNOLOGIES FOR EMERGING MARKETS
By Shiva Rai
Optical Interconnects
Traditional data centers are consuming more than 2% of the world’s electricity today and global data traffic is expected to double every four years. In the future, data transfer between racks using electronic packet switches will not simultaneously meet the requirements for bandwidth and energy consumption. With the data center business model shifting to cloud computing, much greater volumes of data processing and transfer will be handled in coming years (Figure 3).
Figure 3. Cloud computing will exacerbate the challenge of data center energy consumption.
Si photonics and InP PIC-based optical interconnects are being developed to address these data center challenges. Transceiver modules at 100GbE are already in the market, with a steady push towards 400GbE and beyond. Si photonics enable faster data transfer over longer distances compared to conventional electronics, while utilizing semiconductor lasers and the efficiencies of high-volume Si manufacturing.
https://www.appliedmaterials.com/nanochip/nanochip-fab-solutions/nov-2020/photonics
Well that should do it...:) Thx xster cred!
"and have a professional third-party sponsor introduction."??
I've been trying to figure this out since I read the release? Can you offer anything more on this x? TIA
I love your thinking Scope, DC's, Defense...did he hear something from a little birdie? Loudon county is exploding in growth! Something prompted him to take a position.
I think your spot on Matty, it's just a scout position to get it on the board to keep eyes on it.
Agree, just happy to see it on their list of "New Buys"
A good find but $570, really? I know it's a starter position but jeeze.....:)
12/8/20
“The widespread pairing of logic and memory with optical I/O will be an epochal moment in communications history,” said Ian Redpath, practice leader, components, transport & routing, at Omdia. “The co-packaged optics effort is progressing on multiple fronts: attracting heavyweight R&D
https://opticalconnectionsnews.com/2020/12/cobo-launches-co-packaged-optics-working-group/
12/9/20
Facebook, Microsoft and the Collaboration
"As things are institutionally arranged, we think that the key influencer on the data center CPO form factors will be the CPO Collaboration, which is an alliance of Facebook and Microsoft with other big cloud vendors likely to join in the near future. If there is to be a CPO MSA, the Collaboration is where it is going to come from."
https://cir-inc.com/co-packaged-optics-of-form-factors-and-future-fights/
Great find RL...
SALES OF PRODUCTS BASED ON CO-PACKAGED OPTICS WILL START IN 2022
Dec. 8, 2020
LightCounting Updates Forecast for High Speed Cables (AOCs, ACCs, AECs and DACs) as well as Embedded and Co-Packaged Optics.
This means that first products using ASICs co-packaged with optics will be announced in 2021. Do we know this for sure? No. Market research is just like quantum mechanics – nothing is 100% certain, but the probability of this event is very high, as detailed in the report.
Skeptics would argue that development of the co-packaged optics technology is just starting. COBO and OIF just announced their working groups in the end of 2020. Co-packaged optics (CPO)collaboration launched by Facebook and Microsoft in 2019 is just offering guidelines for suppliers. The standards for CPO are years away.
All of this is true, but first implementations of CPOs will be based on proprietary solutions. Several large companies are working on this technology now, including AMD, Broadcom, Cisco, Huawei, Intel, Nvidia, Samsung and TSMC. All this work is highly confidential and LightCounting has no insider knowledge of the status of these projects, but this is a race and first announcements are probably just months,if not weeks away.
http://www.lightcounting.com/light-trends/sales-products-based-co-packaged-optics-will-start-2022/
Yup, either or both will do :)
Could LWLG been in the running?
NEW FOR 2020: ECOC EXHIBITION INDUSTRY AWARDS
To celebrate the 25th anniversary of the event, ECOC has introduced the ECOC Exhibition Industry Awards, in conjunction with Optical Connections.
The six awards will feature the following categories: Data Centre Innovation/Best Product, Innovative FTTx Product, Most Innovative Product, Optical Integration (SiPh and/or other), Optical Transport Award, and Best Fiber/ Fiber Component Product.
Winners announced on Tuesday 8th December
https://www.ecocexhibition.com
Great find x, thanks. for posting! "Speculation is high on a potential buyout from a major such as Intel"....
"They Will Be Bought Out, Period"
That sounds pretty definitive xster...any time frames and or price predictions? We've been here a loooooong time and I'd love to know your current thoughts. Do you think we get taken out before we ever get a chance for an uplisting to the big boards? That would be quite an achievement!
No, that actually does help...:)
Yes, quite the story, founder was taken un Peter Theil's wing when he was a teenager at Stanford U. Received a grant from Peter to focus on the company and dropped out. As of yesterday, he had over 100m shares and worth above $3B basically overnight.
Your command of the science is truly impressive jeunke22, I'll never know half of what you've already forgotten. My only question is when in God's name will we have the reveal party for polymers? When will we be able to put the words Intel (insert company)/Lightwave/Polymers in the same sentence and have something tangible besides speculation to back it up? Will we be under the protective, secretive cloak of an NDA to infinitum? If Intel (insert company) is actually working with us, let's state so and get on with it, for the love of Mary!
I do greatly appreciate your input though.