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UBIQUITOUS lwlg will be all over the place
Obviously, you don't think this miraculous polymer, will change everything for everything. We do.
You and your scum friends also said Russell deletion would be a disaster for the share price. Like all the BS you short friends spread that turned out a lie. On the contrary Proto called it spot on.
A buy-out will happen and it will make you look like a poor loser.
Both...contract will lead to buyout
Imo
LWLG must have contracts signed.
So why schlep around to conferences
Ha!! Too funny!! Yves will be inking deals with Tier 1's within the next 3 months, remember that Yves told investors that of the 10 companies already in the Stage 1/2 level there would be 2-3 of them to move to Stage 3 normally within 3-6 months timeframe and we are now on the back half of that window, it looks like the MM's were the winners and were able to Cover their Naked Shorting, but there are still over 20 million Shorts that need to Cover, when Yves starts dropping Tier 1 partnering deals, perhaps with investment stake, the Shorts may all try to squeeze through that exit door all at once, now that would be fun to watch!!
Thin-Film LiNbO3 (TFLN) versus LWLG Electro-optic Polymers
Performance
Thin-Film LiNbO3 (TFLN)
- r33 intrinsically capped at ~ 31 pm/V at 1310 nm
- n = 2.2, er = 30 (high dispersion across frequencies)
LWLG Electro-optic Polymers
- No intrinsic cap on r33 (> 200 pm/V at 1310 nm easily achieved)
- n ˜ 1.9, er ˜ 3-6 (low dispersion across frequencies)
Integration
Thin-Film LiNbO3 (TFLN)
- Integration with Si/SiN very low yielding & basically still in R&D stage
- Limited wafer size (150 mm)
- Large device footprint (sub-cm scale)
- High material cost w/ only one supplier (NanoLN)
LWLG Electro-optic Polymers
- Fully Si compatible
- Easily scalable to 300 (+) mm wafer
- Very small device footprint (sub-mm scale)
- Low material cost
Processing
Thin-Film LiNbO3 (TFLN)
- Thin film uniformity becomes difficult as wafer size scales up
- Specialized processing/tools needed – leads to higher costs
associated with processing, QC, etc.
LWLG Electro-optic Polymers
- Spin-coating produces films with high uniformity
- No specialized processing/tools needed (completely compatible
with existing Si foundry processes/tools) – reduces costs
associated with processing, QC, etc
Slide 13 from 2025 LWLG ASM presentation found here,
https://irp.cdn-website.com/a5f8ef96/files/uploaded/2025_ASM_Presentation_-_FINAL-40e13d6a.pdf
Where are you Mark Lutkowitz? Here I even DETAILED the differences Yves pointed out on Slide 13 here for you!!!!
You just made up a random number. With a take over you can at best expect 20 - 50%. But let's say 2$ per share. If that happens you'd be smart to sell and walk away but many (especially Belgians and Dutch) will be stubborn enough to hang around and refuse to admit they were wrong.
Good time to short as well. Enjoy the summer!
Vaporware
Actually he joined the board a year ago, then went out and spoke to the industry and convinced the board that the demand was there but the approach to market was wrong.
6 months as CEO and his strategy and execution soon will be obvious. Looks like the options have vested. I would not look for an announcement today, yawn, Thursday, Friday, Saturday, Sunday. The Big beuitiful bill will open up quite a few things. A rising tide lifts all boats, but one that I know of has hydroplanes being deployed.
X
Another 150k shorts reported as returned overnight lol still have 19.5 million. Market closes at 1:00 today and is closed Friday. You boys and girls have a wonderful day, I'm taking the skis down the Delaware coast to Sambos crabs for lunch so I won't do the play by play today, ah, the beautiful port of Leipsic at low tide, lol.
Happy as a clam.
X, Im getting too old for this.
The shorts are getting squishy and squirmy, they need to relax and keep telling themselves nothing is going to happen. I predict a 15% interest rate for them over the weekend and the B.B.B to pass before 8:00 A.M. which is great for businesses in the U.S. roar, Wait for it, it is coming.
You seem to be pissed that Ted has been correct and you have been wronGGG. Don't blame Ted for your badd judgement and decisions.
Reality is a harsh mistress for delusional hopium smokers.
Welp, JULY is here and Yves/Eve has been with LWLG for a year now and ZERO significant CONtracts for the grey/brown goo have been landed. Zip. Of course no Tier 1s, butt nothing of any meaningful revenue significance either. Nor with any major semicon players.
Eve enjoys his semi-retirement gig with fully expensed meals, travel, lodging, and entertainment - plus a nifty salary and benefits. Very little actual work required, it's very much like his retirement, just his ~OUTT-of-pocket costs are severely reduced and his travel, including international, is free - and prolly first class, and if nott certainly binniss class and five-star hotels. Plus Eve getts another year or three to stuff his 401(k) with tax-deductible pre-tax salary Dollars.
Being a pennystock CEO is a great retirement plan. Thanks to the Belgians and the Dutch, Merika has one less retiree that needs to sponge off Medicare and Social Security. At least until LWLG winds down and goes fka. So mebbe a cuppla years. Mebbe longer if Eve can drain more cash from the Belgians and Dutch via selling them PPs or CONvertible debt notes. Everbuddy loves a floorless CONvertible note.
We all know that your agenda has never been based on seeking truth. The commercialization pivot LWLG executed and your "predictions" are absolutely unrelated. You like to take credit for it though. Liars like to do things like that.
Why would you write something like this. You say you're not really interested anymore...you have other stocks you're working on...you only check in now and then....yet you write something like this. You're a liar Tedpeele.
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| Moderators pochemunyet x993231 Pro_v12001 LOVELWLG JLPTNG KCCO7913 | |||
The need for Lightwave Logic’s proprietary electro-optic polymers is more evident than at any prior point in history, with internet infrastructure coming under increasing strain due to increased online activity. For example, during the recent COVID-19 pandemic, leading platforms such as YouTube prevented high-definition (HD) streaming in Europe due to data throughput issues in existing internet infrastructure.
The Company’s current focus is on the datacom and telecommunications hardware supply chain for the 100 Gbps and 400 Gbps fiber optics communications market, seeking to integrate its proprietary materials into the devices that comprise key components in today’s internet infrastructure. Lightwave Logic’s unique value proposition, including ease of manufacture relative to traditional solutions, has driven several tier-1 and tier-2 potential strategic partners in the data and telecommunications markets to enter into non-disclosure agreements (NDAs) with Lightwave Logic to evaluate its technology for use in their devices, validating the demand for the Company’s solution in the marketplace. The Company expects to introduce its technology into the commercial marketplace in the near future.
Lightwave Logic is a wholly U.S.-based company with in-house materials synthesis, device/package design, wafer fabrication and testing capabilities at its Englewood, Colorado headquarters.
Having the modulator and integrated circuit development in-house has informed the materials development direction and vice versa. This vertically integrated business model enables a superior platform by aligning the design for manufacturability from materials to complex circuits with the following benefits:
Materials are called electro-optic when they enable interactions between applied electric fields and light passing through them. Notably, they change the refractive index seen by the light with minimum loss. The result is an instantaneous and accurate conversion of an electrical signal to an optical signal. Optical signals are better for transmission over distance: an increasingly useful feature as digital signal speeds are now reaching the GHz and THz ranges and the corresponding electrical transmission distances are shrinking to meters and centimeters.
EO polymers are intrinsically superior in speed and sensitivity to electric field to traditional electro-optic materials such as Lithium Niobate, Indium Phosphide and Silicon. They are engineered materials, made by embedding a variety of specially designed electro-optic chromophore molecules into a wide range of standard host polymers.
Chromophores are complex, large molecules, on a scale akin to drug molecules. They are hyperpolarizable, meaning their electron clouds are easily pulled into a different shape by the applied electric field, changing their optical properties such as index of refraction.
The material is poled to become electro-optic by applying a strong electric field along with heat. The hot material is relatively soft, allowing the chromophore molecules suspended in the host polymer to align in the same direction (poling). Cooling the poled material after the molecules are in place traps them in their active state even after the poling field is removed.
Although the electrons in the material respond to any applied electric field, they remain tightly bound to the molecule. The response to an applied signal is almost instantaneous response and recovery– like that of a tight spring– unlike materials that involve much slower macroscopic movement of free electrons.
Another key difference from traditional crystalline materials is the performance of EO polymers continues to improve as chemists explore the almost unlimited design space. Combinations of chromophores and host polymers can be tailored for specific applications.
In addition to innovating the EO polymer materials, Lightwave Logic takes its technology platform to the next level by developing ancillary materials and processes. These elements are brought together and demonstrated in advanced high-speed optical modulators.
The polymer is spun onto silicon wafers and standard microfabrication techniques are used to deposit and pattern metal electrodes and optical waveguides.
One well-known optical modulator device is the Mach-Zehnder interferometer. The light output is changed by changing the relative phase between the two arms. One common trick to double the effect for the same available drive voltage is to drive the two arms in opposite directions (push-pull mode). Polymers have an interesting advantage over most other electro-optic materials which are crystalline. The direction of polymer’s electro-optic activity is entirely determined by the direction of the applied poling field. By poling the two arms of the Mach-Zehnder in opposite directions, the resulting device automatically has push-pull operation with a single applied signal.
Once the modulator chip is made, it is packaged for mechanical protection and also to ensure signal quality for electrical and optical connections.
Below is a polymer optical modulator with >60 GHz bandwidth packaged with high-speed electrical connectors and optical pigtails.
Inspired by the remarkable record of integrated microelectronics, the opto-electronics industry has great interest in developing photonic integrated circuits (PICS). Photonics refers to devices that manipulate photons—that is, light—rather than electrons.
Even the best individual devices can be made more functional by integrating many together. Integration has many benefits, the most notable being dramatic improvements in size and cost. Yet, photonic integration has only recently come into the spotlight. The primary applications for photonics used to require stand-alone, high performance components such as used for long-haul telecom.
Now, photonic integration has suddenly come into the spotlight as electronic interconnects struggle to keep up with speed increases of electronic chips. Photonics is being looked at to replace electronics in already highly integrated applications such as chip interconnect. Co-packaging of electronics integrated circuits (ICs) with photonic interconnect, considered unlikely a few years ago, is now viewed by many as inevitable. However, this requirement poses new challenges that are acknowledged as difficult and that new technologies will be required to meet them.
P2IC™ (Polymer Photonic Integrated Circuits) are ideally positioned to be one of these new technologies. Lightwave Logic’s devices are made using conventional wafer-scale processing such as used for microelectronics and therefore similarly capable of being integrated. In addition, the polymer microfabrication processes are compatible with other materials platforms such as Silicon Photonics and Indium Phosphide which are now starting to become more integrated. In particular, the Silicon Photonics ecosystem has recently accepted that its roadmap will include adding more and more materials, each for their specific benefits. EO polymers’ speed and voltage advantages are attractive additions to this ecosystem.
A fiber link sends data from a transmitter to a receiver through an optical fiber cable. Lightwave Logic’s technology can be used to make a data modulator, a central function of the transmitter.
Datacenters and high-performance computing (HPC) are two market segments that demand the very highest speed optical fiber communications. The datacenter fiber communications segment includes applications ranging from connections inside hyperscale datacenters to fiber links between datacenter campuses.
Optical fiber communication is the infrastructure that supports internet content through its entire lifecycle, between businesses, consumers and datacenters. Behind the scenes, massive amounts of data move between computer processors inside datacenters (or inside supercomputers) as content is generated. In addition to these intra-datacenter links, there are also significant datacenter interconnection links between big datacenters to provide flexible capacity and resilience – all of these represent significant addressable market segments for Lightwave Logic’s technology.
Modulator performance limits the speed of the transmitter, which in turn limits the data-carrying capacity of the entire fiber link. EO polymers have superior speed and sharply reduce the electrical power needed to operate the modulators.
Lightwave Logic estimates that in 2019, the total market for opto-electronic components used in the fiber optics market reached a value of ~$26 billion and is forecasted to grow to approximately $80 billion by 2030.
Above: Market forecasts for photonic (electro-optic) components and transceivers used in optical fiber communications. (Source: Oculi LLC)
The growth in the optical fiber communications market is driven by many factors, primarily:
The historic trend has been a migration from text to graphics, followed by still graphics to increasingly high-definition video. On the accessibility front, the introduction of 5G will enable low-cost mobile internet connections at the same, or higher speeds, as today’s home broadband. This trend continues today as users demand more data at all times.
Recently, particularly since the onset of the COVID-19 pandemic, there has been a sharp increase in reliance on video-conferencing services, often replacing in-person meetings. As video conferencing becomes more commonly used, users will continue to demand faster response times to enable no-lag, real-time communications in full HD.
The benefits of EO polymers, such as low power usage, high speed, increased throughput and lower cost make them ideally suited for markets outside of communications as well, including in consumer, media, augmented reality/virtual reality, medical and industrial applications.
Developing, protecting and commercializing intellectual property is central to Lightwave Logic’s identity as a technology company. Lightwave Logic has over 50 U.S. and international patents and applications that are issued or pending.
These patents provide freedom of manufacture for the company’s electro-optic (EO) polymer materials systems and its optical device technology.
Lightwave Logic’s patent portfolio covers the following areas:
The company continuously seeks to innovate new electro-optic chromophores, designing molecular architectures to meet application needs such as high electro-optic activity and stability. We also design ancillary materials that are useful in conjunction with the EO polymers themselves. Example patents within the materials category include:
| Publication Number | Title |
|---|---|
| US Patent 7,902,322 | Nonlinear optical chromophores with stabilizing substituent and electro-optic devices |
| US Patent 9,535,215 | Fluorinated Sol-Gel Low Refractive Index Hybrid Optical Cladding and Electro-Optic Devices Made Therefrom |
As the company demonstrates its materials in devices, such as modulators, it has engineered ways to enhance device performance by means of device design and optimized control. Example patents within the optical device category include:
| Publication Number | Title |
|---|---|
| US Patent 10,520,673 | Protection layers for polymer modulators/waveguides |
| US Patent 7,738,745 | Method of Biasing and Operating Electr-Optic Polymer Optical Modulators |
Materials innovations are followed by methods in which the Company or its partners can best work with the materials in the fabrication process. Example patents within the fabrication category include:
| Publication Number | Title |
|---|---|
| US Patent Application 20190353843 | Fabrication process of polymer based photonic apparatus and the apparatus |
| US Patent 10,591,755 | Direct-drive polymer modulator methods of fabricating and materials therefor |
Polymers can be used to add functionality to existing semiconductor devices, inclusive of making photonic integrated circuits (ICs). Areas of active innovation include how to get light from one material system into another with minimal losses. Example patents within the semiconductor integration category include:
| Publication Number | Title |
|---|---|
| US Patent 10,527,786 | Polymer modulator and laser integrated on a common platform and method |
| US Patent 10,511,146 | Guide transition device with digital grating deflectors and method |
Challenges for high-speed optical packaging includes maintaining the quality of radio-frequency electrical signals and hermetic/environmental sealing of devices for durability (while still allowing light to go through). Example patents within the packaging category include:
| Publication Number | Title |
|---|---|
| US Patent 10,574,025 | Hermetic capsule and method for a monolithic photonic integrated circuit |
| US Patent 10,162,111 | Multi-fiber/port hermetic capsule sealed by metallization and method |
We cannot assure you that we will meet the conditions of the 2023 Purchase Agreement with Lincoln Park in order to obligate Lincoln Park to purchase our shares of common stock, and we cannot assure you that we will be able to sell any shares under or fully utilize the Roth Sales Agreement. In the event we fail to do so, and other adequate funds are not available to satisfy long-term capital requirements, or if planned revenues are not generated, we may be required to substantially limit our operations. This limitation of operations may include reductions in capital expenditures and reductions in staff and discretionary costs.
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