Monday, October 31, 2016 8:28:03 AM
I quoted from the article. Here it is again:
"Materials and methods
Isonicotinic acid (iNA), copper(II) sulfate pentahydrate
(CuSO4.5H2O), hydrazine hydrate (N2H4.H2O),
ethylenediaminetetraacetic acid (EDTA), formaldehyde
solution (37 wt%), tin(II) chloride (SnCl2), and
palladium(II) chloride (PdCl2) were purchased from
Sigma-Aldrich, Ltd. and used as received. Aluminacoated
silicon wafers prepared by atomic layer deposition
(ALD) were provided by Natcore Technology,
Inc. (NTX.V)."
Here's the link:
http://paperity.org/p/78294606/surface-initiated-growth-of-copper-using-isonicotinic-acid-functionalized-aluminum-oxide
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