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Tuesday, 02/09/2016 6:00:35 AM

Tuesday, February 09, 2016 6:00:35 AM

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Overview of the PIC International

PIC International - 1-2 March 2016, Brussels, Belgium
2 Days. 6 Themes. 34 presentations. 92 companies. 17 countries.

Everyone's going
Connecting, informing and inspiring the integrated photonics community

Sales of PICs are soaring, with their deployment helping to boost the capacity of networks and data centres. To aid this industry, we are strengthening the relationships between the makers and the users of these integrated circuits by launching PIC International, a global conference dedicated to this industry.

Attendees at the inaugural PIC International conference will hear industry-leading insiders delivering more than 30 presentations spanning six sectors.

PIC International provides comprehensive coverage of all aspects of this industry, from basic research to materials, equipment, packaging, and the incorporation of chips in data centres and optical networks. So whether you focus on system integration, developing and manufacturing components, financing this sector, or providing the materials and equipment needed to support this industry, PIC International is your must-attend conference for 2016.

Less than 3 weeks to book your place.
http://www.picinternational.net/register

Countries represented include:
BELGIUM, CANADA, DENMARK, FRANCE, GERMANY, GREECE, IRELAND, ISRAEL, ITALY, JAPAN, KOREA REPUBLIC, NETHERLANDS, SLOVAKIA, SLOVENIA, SWITZERLAND, UNITED KINGDOM, UNITED STATES.

Companies attending include:
Aarhus University, Acacia Communications, Adva Optical Networking Se, Aifotec Ag, Alcatel Lucent, Aristotle University Of Thessaloniki Auth, ArtIC Photonics, Aurrion, Avago Technologies, Bay Photonics Ltd, BB Photonics, Bright Photonics, CEA Leti, Cip, Cisco, Color Ltd, Commscope, Coriant, Corning Optical Communications GmbH & Co KG, Csem Sa, Eblana Photonics Ltd, EDA Solutions, Egide Sa, Eidikos Logariasmos Kondilion Erevnas Aristotle University Of Thessaloniki, ePIXfab, EV Group, ficonTEC, Finisar, Fraunhofer For Telecommunications, Global Communication Semiconductors, LLC, Glucosense, HP, Huawei Technologies, Huber Suhner, IBM, IHT, Imec, Inha University, Innovion, INPHOTEC TeCIP Inst, Intec Ugent, IMEC, Intengent, International Laser Center, Istituto Superiore Mario Boella, Jabil, JePPIX, Jozef Stefan Institute, Jsr Micro Nv, LightCounting Market Research, Lightwave Logic, Linkra, LioniX, Luceda Photonics, Lumerical, Luxtera Inc, McGill University, Mcmaster University, Mellanox Technologies, Microsoft, Multiphoton Optics Gmbh, Nasp, National Research Council Canada Nrc, Ntt, Nufern, Oclaro, Petra, Phoenix Software, Politecnico di Milano, Polytec Gmbh, Ranovus, Samtec, SMART Photonics, Source Photonics, Suss Microoptics Sa, Technobis, TeCIP Institute, TEEM PHOTONICS, Telnet, TeraXion, TU Eindhoven, Tyndall National Institute, University Of Ljubljana Faculty Of Electrical Engineering, University Of St Andrews Uk, Visiorobotics, VLC Photonics, VPI Photonics, Vrije Universiteit Brussel, X-Celeprint, Xio Photonics.

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