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Spectra7 Microsystems Ltd Canada Headquarters:[CLICK PICTURE FOR LINK]
2550 North First Street, Suite 500
San Jose, CA 95131
Spectra7 Microsystems Corp.
110 Cochrane Drive, Suite 202
Canada L3R 9S1
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About Spectra7 Microsystems
Spectra7 makes the electronic products we use everyday dramatically thinner, lighter and higher performance.[UPDATED 060417]
These products include ultra-thin 4K Panels, Ultra HD displays, head-mounted displays for both virtual reality and augmented reality, and data centers. Significantly thinner data and information conduits are achieved by addressing the electro-magnetic interference (EMI), signal loss, reflections and crosstalk in these platforms with Spectra7's analog chip technology; as opposed to the traditional technique of mechanical shielding, thicker conduits containing more copper, or expensive, bulky connectors. Spectra7’s technology can enable the removal of as much as 90% of the bulk and metal traditionally needed to maintain signal integrity amidst these signal impairments.
This results in radically thinner platforms, and interconnects within, and between, electronic devices. Laptops and other handheld consumer electronics become lighter and leaner allowing for sleeker and improved design. High-end displays that support 4K Ultra HD can become light, bendable and translucent when they employ Spectra7-based interconnects inside and/or outside the panel. The process by which S7 technology works is comparable to the technology behind noise-cancelling headphones, except S7 runs at a million times higher frequency. Audio noise-cancellation succeeds in eliminating the distracting background of a jet-engine as interference to an audio experience allowing the user to hear only the clean, clear, original audio.
Instead of the audio frequency, Spectra7's analog chip technology operates at frequencies that are a million times higher. S7 technology is achieved with very small, tiny, analog microchips. These chips contain patented and proprietary algorithms that allow signals to co-exist in and around each other, without bulky metal work to keep them separate.
The result is a collapse of the platform for these devices by as much as 85% or 90%.
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